Polymer-based micromachining for microfluidic devices

• US 6,136,212 A
• Filed: 08/06/1997
• Issued: 10/24/2000
• Est. Priority Date: 08/12/1996
• Status: Expired due to Term

• Current Assignee: Nanoselect, Inc.
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Man, Piu F., Webster, James R., Mastrangelo, Carlos H.
• Primary Examiner(s): Gulakowski, Randy
• Assistant Examiner(s): OLSEN, ALLAN W
• Application Number:
  US08/907,184
• Time in Patent Office: 1,175 Days
• Field of Search: 216/2, 216/27, 216/49, 313/578, 313/583, 435/287.2, 436/180
• US Class Current: 216/49
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00828 Silicon wafers or plates
• CPC Class Codes: B01J 2219/00833 Plastic
• CPC Class Codes: B01J 2219/00853 Employing electrode arrangements
• CPC Class Codes: B01J 2219/00873 Heat exchange
• CPC Class Codes: B01J 2219/00889 Mixing micromixers B01F33/30
• CPC Class Codes: B01J 2219/00891 Feeding or evacuation
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2400/0442 thermal energy, e.g. vaporisation, bubble jet
• CPC Class Codes: B01L 2400/046 Chemical or electrochemical formation of bubbles
• CPC Class Codes: B01L 2400/0655 pinch valves
• CPC Class Codes: B01L 2400/0688 surface tension valves, capillary stop, capillary break
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/50273 characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 : photolithography
• CPC Class Codes: B41J 2/1639 : sacrificial molding
• CPC Class Codes: B41J 2/1642 : thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1645 : thin film formation by spincoating
• CPC Class Codes: B81C 1/00071 : Channels
• CPC Class Codes: G03F 7/00 : Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K
• CPC Class Codes: G03F 7/40 : Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10155 : being other than a cuboid

Abstract

The present invention relates to polymer-based micro-electro-mechanical system (MEMS) technology suitable for the fabrication of integrated microfluidic systems, particularly medical and chemical diagnostics system, ink-jet printer head, as well as any devices that requires liquid- or gas-filled cavities for operation. The integrated microfluidic systems may consist of pumps, valves, channels, reservoirs cavities, reaction chambers, mixers, heaters, fluidic interconnects, diffusers, nozzles, and other microfluidic components on top of a regular circuit substrate. This technology is vastly superior than any alternatives available such as glass-based, polysilicon-based MEMS technology as well as hybrid `circuit board` technology because of its simple construction low cost, low temperature processing, and its ability to integrate any electronic circuitry easily along with the fluidic parts.

Claims

1. A method for fabricating microchannels, comprising the steps:

a) providing a substrate, said substrate having upper and lower surfaces;

b) depositing a first polymer layer on said upper surface of said substrate, said first polymer layer having i) a lower surface contacting said upper surface of said substrate and ii) an upper surface;

c) depositing a second polymer layer on said upper surface of said first layer, said second polymer layer having i) a lower surface contacting said upper Surface of said first layer and ii) an upper surface;

d) exposing said first polymer, and

e) sacrificially etching said first polymer layer under conditions such that said second polymer layer comprises walls of a microchannel.

2. The method of claim 1, wherein said substrate is a silicon substrate.

3. The method of claim 1, wherein said desired thickness of said first polymer layer is between 0.5 and 100μ

.

4. The method of claim 1, further comprising, prior to step (d) the step of photolithographically defining said second polymer layer.

5. The method of claim 1, further comprising, after step (e) the step (f) of etching openings in said walls of said microchannel.

6. The method of claim 5, further comprising after step (e) and before step (f) the step of depositing a third polymer layer on said upper surface of said second polymer layer.

7. The method of claim 1, wherein said first polymer and said second polymer comprise photoresist polymeric material.

8. A method for fabricating microchannels, comprising the steps:

a) providing a silicon substrate, said silicon substrate having tipper and lower surfaces;

b) depositing a first polymer layer with a defined thickness of 0.5 to 100 μ

m on said upper surface of said silicon substrate, said first polymer layer having i) a lower surface contacting said upper surface of said silicon substrate and ii) an upper surface;

c) photolithographically defining said first polymer;

d) depositing a second polymer layer on said upper surface of said first layer, said second polymer layer having i) a lower surface contacting said upper surface of said first layer and ii) an upper surface;

e) exposing said first polymer, and

f) sacrificially etching said first polymer layer under conditions such that said second polymer layer comprises walls of a microchannel.

9. The method of claim 8, wherein said desired thickness of said first polymer layer of step (c) is between 0.5 and 100μ

.

10. The method of claim 8, further comprising, prior to step (e) the step of photolithographically defining said second polymer layer.

11. The method of claim 8, further comprising, after step (f) the step (g) of etching openings in said walls of said microchannel.

12. The method of claim 11, further comprising after step (f) and before step (g) the step of depositing a third polymer layer on said upper surface of said second polymer layer.

13. The method of claim 8, wherein said first polymer and said second polymer comprise photoresist polymeric material.

14. A method for fabricating microchannels, comprising the steps:

a) providing a silicon wafer, said silicon wafer having upper and lower surfaces;

b) depositing a first layer of a first polymer on said upper surface of said silicon wafer, said first polymer layer having i) a lower surface contacting said upper surface of said silicon wafer and ii) an upper surface;

c) depositing a second polymer layer with a defined thickness of 0.5 to 100 μ

m on said upper surface of said first layer, said second polymer layer having i) a lower surface contacting said upper surface of said first layer and ii) an upper surface;

d) photolithographically defining said second polymer;

e) depositing a second layer of said first polymer on said upper surface of said second polymer layer, said second layer of said first polymer having i) a lower surface contacting said upper surface of said second polymer layer and ii) an upper surface;

f) exposing said second polymer,

g) sacrificially etching said second polymer layer under conditions such that said first and second layers of said first polymer comprise walls of a microchannel, said microchannel having a height defined by said thickness of said second polymer layer; and

h) etching one or more openings in said walls of said microchannel.

15. The method of claim 14, further comprising after step (g) the step of depositing a layer of a third polymer on said upper surface of said second layer of said first polymer.

16. The method of claim 15, wherein said first and second layers of said first polymer comprise vapor-deposited poly-xylene.

17. The method of claim 16, wherein, at step (h), first and second openings are etched, said first opening serving as an inlet and said second opening serving as an outlet.

18. The method of claim 17, wherein said openings are etched from said lower surface of said silicon wafer into said lower surface of said first layer of said first polymer.

19. The method of claim 17, wherein said openings are etched from said upper surface of said layer of said third polymer into said upper surface of said second layer of said first polymer.