Epoxy/thermoplastic photocurable adhesive composition

• US 6,136,384 A
• Filed: 02/29/2000
• Issued: 10/24/2000
• Est. Priority Date: 05/01/1998
• Status: Expired due to Term

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Karim, Naimul, George, Clayton A., Meyer, Christopher M.
• Primary Examiner(s): Seidleck, James J.
• Assistant Examiner(s): McClendon, Sanza L.
• Application Number:
  US09/515,433
• Time in Patent Office: 238 Days
• Field of Search: 522/122, 522/100, 522/102, 522/113, 522/134, 522/143, 524/379, 524/388, 524/430, 525/107, 523/457, 523/420, 523/143, 427/487, 427/508, 427/516
• US Class Current: 427/516
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09J 131/04 Homopolymers or copolymers of vinyl acetate
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31573 Next to addition polymer of ethylenically unsaturated monomer
• CPC Class Codes: Y10T 428/31587 Hydrocarbon polymer [polyethylene, polybutadiene, etc.]

Abstract

A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.

Claims

1. A method comprising the steps of:

a) providing an homogeneous molten mixture comprising a curable epoxy resin, an ethylene-vinyl acetate thermoplastic resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and solvent;

b) applying the mixture to a substrate or processing the mixture into an unsupported film; and

c) at any subsequent time, activating the photocatalyst to cure the epoxy containing material.

2. The method according to claim 1 wherein said method is a batch process.

3. The method according to claim 1 wherein said method is a continuous process.