Ion flow forming method and apparatus

• US 6,136,387 A
• Filed: 07/27/1998
• Issued: 10/24/2000
• Est. Priority Date: 06/25/1998
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Koizumi, Koji
• Primary Examiner(s): PADGETT, MARIANNE L
• Application Number:
  US09/122,673
• Time in Patent Office: 820 Days
• Field of Search: 427/562, 427/563, 427/564, 427/571, 427/575, 118/723 ME, 118/723 MR, 118/723 ER, 118/723 IR, 118/723 FI
• US Class Current: 427/562
• CPC Class Codes: C23C 16/511 using microwave discharges
• CPC Class Codes: C23C 16/515 using pulsed discharges
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma

Abstract

An ion flow forming method and apparatus for attracting ions from a plasma generated in a plasma generation chamber and forming a flow of the ions are disclosed. This ion flow forming apparatus includes the plasma generation chamber having a plasma diffusion outlet port, a processing chamber accommodating a target object, for example, two electrodes arranged between the plasma generation chamber and the target object in the processing chamber, and a potential control unit. This potential control unit controls voltages to be applied to the plasma generation chamber, the two electrodes, and the processing chamber, so that the step of diffusing the plasma generated in the plasma generation chamber in a space between the two electrodes, the ion attraction step of repelling electrons in the diffused plasma toward the plasma generation chamber and attracting the ions in the plasma in an opposite direction, and the ion flow formation step of directing the ions toward the target object are sequentially performed. A method and apparatus including a process of turning on/off the plasma in this cycle are also proposed.

Claims

1. An ion flow forming method of attracting ions from a plasma generated in a plasma generation chamber and forming a flow of the ions, comprising the steps of:

(a) generating the plasma in said plasma generation chamber having a plasma diffusion outlet port;

(b) moving at least a portion of the plasma, generated in said plasma generation chamber, outside said plasma generation chamber through said plasma diffusion outlet port by diffusion;

(c) extracting the ions by applying, to the plasma which has moved outside said plasma generation chamber, an electric field in a first direction to repel electrons in the plasma toward said plasma diffusion outlet port and to attract the ions in the plasma in a second direction opposite to the electrons, by applying in a pulsed manner first and second voltages to respective of first and second electrodes, wherein the first voltage is higher than the second voltage, and the first electrode and the second electrode are sequentially arranged between respective of the plasma diffusion outlet port of the plasma generation chamber and a target object; and

(d) directing the attracted ions toward the target object.

2. A method according to claim 1, wherein the steps (a) to (d) are repeatedly performed in sequential order from (a) to (d).

3. A method according to claim 1, wherein the step (a) is performed constantly.

4. A method according to claim 1, wherein

the step (d) is performed by stopping, after the ions are extracted toward the object from a space between said first and second electrodes, application of the voltages to said first and second electrodes.

5. A method according to claim 1, wherein the step (d) is performed by applying, to a third electrode arranged between said first and second electrodes and the target object, at least one of an ion accelerating voltage and an ion beam convergence voltage.

6. A method according to claim 1, wherein the step (d) comprises the step of dispersing the ion flow in a path of the ions to reach the target object from said first and second electrodes.

7. A method according to claim 1, wherein the electric field in the step (c) has a pulse frequency of 3 KHz to 100 KHz.

8. A method according to claim 7, wherein in the step (c), when the ions contain an ion having a mass different from a predetermined mass, the ion having the different mass is extracted by performing either one of frequency modulation and amplitude modulation, while keeping unchanged a pulse ratio of an ion acceleration time to a plasma diffusion time.

9. A method according to claim 1, wherein in the step (d), the target object to which the attracted ions are directed is a silicon wafer with a circuit pattern formed thereon.

10. A method according to claim 1, wherein the step (a) is the step of generating the plasma by electron cyclotron resonance.

11. A method according to claim 10, wherein the step (c) further comprises blocking introduction of at least one of an external magnetic field and microwaves, for generation of the electron cyclotron resonance plasma.