Energy cured sealant composition

• US 6,136,398 A
• Filed: 05/01/1998
• Issued: 10/24/2000
• Est. Priority Date: 05/01/1998
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Meyer, Scott R., Meyer, Christopher M., Willett, Peggy S.
• Primary Examiner(s): Dawson, Robert
• Assistant Examiner(s): AYLWARD, DAVID E
• Application Number:
  US09/071,267
• Time in Patent Office: 907 Days
• Field of Search: 525/107, 525/113, 525/120, 525/177, 525/438, 428/41.3, 428/41.7, 428/41.8
• US Class Current: 428/41.3
• CPC Class Codes: C08L 23/08 Copolymers of ethene C08L23/16 takes precedence
• CPC Class Codes: C08L 2312/00 Crosslinking
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/18 Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 67/00 Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain of polyester-amides C08L77/12; of polyester-imides C08L79/08; Compositions of derivatives of such polymers
• CPC Class Codes: C09D 167/00 Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain based on polyester-amides C09D177/12; based on polyester-imides C09D179/08; Coating compositions based on derivatives of such polymers
• CPC Class Codes: C09K 2200/062 Polyethylene
• CPC Class Codes: C09K 2200/0622 Polyvinylalcohols, polyvinylacetates
• CPC Class Codes: C09K 2200/0647 Polyepoxides
• CPC Class Codes: C09K 2200/0655 Polyesters
• CPC Class Codes: C09K 3/10 Materials in mouldable or extrudable form for sealing or packing joints or covers filling pastes C09D5/34
• CPC Class Codes: Y10T 428/1452 Polymer derived only from ethylenically unsaturated monomer
• CPC Class Codes: Y10T 428/1471 Protective layer
• CPC Class Codes: Y10T 428/1476 Release layer

Abstract

A curable composition formed by mixing components comprising 10 to 70 weight percent of a curable epoxy resin; an effective amount of a curative for the epoxy resin; 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer; and 5 to 60 weight percent of a thermoplastic polyester resin, the parts by weight being based on the total weight of the resin in the composition.

Claims

1. A curable composition formed by mixing components comprising:

a) 10 to 70 weight percent of a curable epoxy resin;

b) an effective amount of a curative for the epoxy resin;

c) 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer; and

d) 5 to 60 weight percent of a thermoplastic polyester compatibilizing resin,

wherein the sum of a), c), and d) above equals 100 weight percent.

2. The curable composition according to claim 1 wherein said composition is a molten mixture.

3. The curable composition according to claim 1 further comprising up to 50 percent by volume of one or more additives that alters the physical characteristics of the resulting cured composition.

4. The curable composition according to claim 1 wherein said composition is an unsupported film.

5. The curable composition according to claim 1 wherein the epoxy resin comprises at least one of an aliphatic, alicyclic, aromatic, and heterocyclic polyepoxide.

6. The curable composition according to claim 1 wherein the curative is at least one of a photocatalyst and a thermal curing agent.

7. The curable composition according to claim 6 wherein the thermal curing agent is selected from the group consisting of aliphatic primary and secondary amines, aromatic primary and secondary amines, aliphatic tertiary amines, aromatic tertiary amines, and mixtures thereof.

8. The curable composition according to claim 6 wherein the thermal curing agent is selected from the group consisting of fluorene diamines, boron trifluoride complexes, imidizoles, hydrazines, guanidines, and mixtures thereof.

9. The curable composition according to claim 1 wherein the thermal curing agent comprises dicyandiamide.

10. The curable composition according to claim 1 wherein said ethylene-vinyl acetate copolymer contains from about 28 to about 80 percent by weight vinyl acetate.

11. The curable composition according to claim 1 further containing a hydroxyl containing material.

12. The curable composition according to claim 1 wherein the composition is applied to a substrate and cured.

13. The cured composition according to claim 12 wherein the substrate is a metal or a polymer.

14. The curable composition according to claim 4 wherein the unsupported film is attached to a substrate and cured.

15. The cured composition of claim 14 used as a protective or decorative coating on a substrate.

25. The curable composition according to claim 1 wherein said thermoplastic polyester compatibilizing resin prevents phase separation of the ethylene-vinyl acetate copolymer and the epoxy resin when the composition is in a molten state.

16. An article comprising:

a) a curable composition in the form of a film formed by mixing components comprising;

i) 10 to 70 weight percent of a curable epoxy resin,

ii) an effective amount of a curative for the epoxy resin,

iii) 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer, and

iv) 5 to 60 weight percent of a thermoplastic polyester compatibilizing resin, wherein the sum of i), iii), and iv) above equals 100 weight percent; and

b) a release liner or a backing attached to said film.

17. The article according to claim 16 wherein the article is a tape or a protected film.

18. The article according to claim 16 provided in a roll construction.

19. The article according to claim 16 further comprising a barrier coating attached to said film opposite said release coating or backing.

20. A method comprising the steps of:

a) providing a molten mixture including;

i) 10 to 70 weight percent of a curable epoxy resin,

ii) an effective amount of a curative for the epoxy resin,

iii) 10 to 85 weight percent of a thermoplastic ethylene-vinyl acetate copolymer, and

iv) 5 to 60 weight percent of a thermoplastic polyester compatibilizing resin, wherein the sum of i, iii, and iv equals 100 weight percent;

b) applying the molten mixture to a substrate for processing into an unsupported film; and

c) at any subsequent time, activating the curative to produce a cured composition.

21. The method according to claim 20 wherein the molten mixture is processed into a film and further includes the step of applying said film to a substrate.

22. The method of claim 20 wherein the substrate is a metal or a polymer.

23. A curable composition formed by mixing components comprising a molten mixture including:

a) about 30 to about 50 weight percent of a curable epoxy resin;

b) an effective amount of a thermal curing agent for the epoxy resin;

c) about 30 to about 60 weight percent of a thermoplastic ethylene-vinyl acetate copolymer containing at least 40 percent vinyl acetate by weight of the copolymer; and

d) about 10 to about 30 weight percent of a thermoplastic polyester compatibilizing resin,

wherein the sum of a), c), and d) above equals 100 weight percent.

24. The curable composition according to claim 23 wherein the molten mixture is a homogeneous mixture.

26. A curable composition formed by mixing components comprising:

(a) an effective amount of a curable epoxy resin;

(b) an effective amount of a curative for the epoxy resin;

(c) an effective amount of a thermoplastic ethylene-vinyl acetate copolymer; and

(d) an effective amount of a thermoplastic polyester compatibilizing resin,

wherein the composition his significant tack in the uncured state, good cured adhesion to surface treated metals, low controlled flow during curing, and semi-structural adhesive and cohesive strength in the cured state.