Electronic device encapsulated directly on a substrate

• US 6,137,224 A
• Filed: 07/20/1998
• Issued: 10/24/2000
• Est. Priority Date: 12/10/1996
• Status: Expired due to Term

• Current Assignee: ITT Manufacturing Enterprises, Inc. (ITT, Inc.)
• Original Assignee: ITT Manufacturing Enterprises, Inc. (ITT, Inc.)
• Inventors: Centofante, Charles A.
• Primary Examiner(s): Patel, Nimeshkumar D.
• Assistant Examiner(s): HAYNES, MACK NELSON
• Application Number:
  US09/119,082
• Time in Patent Office: 827 Days
• Field of Search: 313/500, 313/506, 313/510, 313/511, 313/512, 313/513, 445/24, 264/255, 264/272.16, 264/272.17, 264/1.7, 340/762, 340/786, 361/1, 228/6.2, 250/577, 257/99, 257/433, 257/81-82, 257/88, 257/680-81, 257/787, 438/5, 438/123, 425/116
• US Class Current: 313/510
• CPC Class Codes: B29C 45/14311 using means for bonding the coating to the articles B29C45/14795 takes precedence
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/2708 Gates B29C45/2703 takes precedence
• CPC Class Codes: B29C 70/74 Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding B29C70/845 takes precedence
• CPC Class Codes: G09F 9/3023 Segmented electronic displays
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.

Claims

1. An alphanumerical display, comprising:

a set of light emitting diodes mounted directly to a printed circuit board; and

a hole through the printed circuit board adjacent to each of the light emitting diodes, the light emitting diodes and holes being arranged to form a display;

wherein each of the light emitting diodes is separately encapsulated in a package of light-transmissive thermoplastic material that has been molded onto and mechanically bonded to the printed circuit board.

2. The display of claim 1, wherein the package of thermoplastic material has been injection molded onto the printed circuit board.

3. The display of claim 1, wherein the package is shaped to focus and reflect light from the light emitting diode out its adjacent hole.

4. The display of claim 1, wherein each hole is completely filled with the encapsulating material such that the encapsulating material on the side of the printed circuit board opposite from the light emitting diodes is substantially flat and flush with the surface of the printed circuit board.

5. The display of claim 1, wherein the holes are lozenge shaped and arranged to form a seven-segment display.