Electronic device encapsulated directly on a substrate
First Claim
1. An alphanumerical display, comprising:
- a set of light emitting diodes mounted directly to a printed circuit board; and
a hole through the printed circuit board adjacent to each of the light emitting diodes, the light emitting diodes and holes being arranged to form a display;
wherein each of the light emitting diodes is separately encapsulated in a package of light-transmissive thermoplastic material that has been molded onto and mechanically bonded to the printed circuit board.
1 Assignment
0 Petitions
Accused Products
Abstract
A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.
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Citations
5 Claims
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1. An alphanumerical display, comprising:
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a set of light emitting diodes mounted directly to a printed circuit board; and a hole through the printed circuit board adjacent to each of the light emitting diodes, the light emitting diodes and holes being arranged to form a display; wherein each of the light emitting diodes is separately encapsulated in a package of light-transmissive thermoplastic material that has been molded onto and mechanically bonded to the printed circuit board. - View Dependent Claims (2, 3, 4, 5)
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Specification