Printed circuit board, IC card, and manufacturing method thereof

• US 6,137,687 A
• Filed: 01/19/2000
• Issued: 10/24/2000
• Est. Priority Date: 08/09/1996
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Fujikawa, Keiji, Matsuoka, Makoto, Sasaki, Hideaki, Kazui, Shinichi, Shirai, Mitsugu
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): Vigushin, John B.
• Application Number:
  US09/487,171
• Time in Patent Office: 279 Days
• Field of Search: 361/748-751, 361/792, 361/795, 361/783, 174/254-258, 174/260, 174/261, 428/209, 428/210, 428/901, 257/679, 235/492, 427/96, 29/830-832, 29/839, 29/840, 29/854
• US Class Current: 361/749
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.

Claims

1. A flexible thin card comprising:

a first conductor layer pattern-printed on a desirable portion on a flexible base board;

a first insulating layer pattern-printed on a desirable portion on said first conductor layer;

a second conductor layer pattern-printed on desirable portions on said first conductor layer and said first insulating layer;

an IC chip mounted on a desirable portion on said second conductor layer;

and a sheet-shaped thin flexible substance laminate-processed via an adhesive agent on an uppermost surface of said base board;

wherein;

an electrode of said IC chip is connected to said second conductor layer without interposing any joint material between them.

2. A flexible thin card as claimed in claim 1 wherein:

a thickness of said first insulating layer is non-uniform.

3. A flexible thin card as claimed in claim 1 wherein:

said IC chip is mounted on said second conductor layer before said second conductor layer is hardened; and

said second conductor layer is hardened under such a condition that the electrode of said IC chip is made in contact with said second conductor layer, whereby the electrode of said IC chip is connected to said second conductor layer.

4. A flexible thin card as claimed in claim 1 wherein:

thicknesses of said flexible base board and said flexible substance are 80 to 100 μ

m;

thicknesses of said conductor layers are 10 to 20 μ

m;

thicknesses of said insulating layers are 20 to 40 μ

m;

a thickness of said IC chip is smaller than, or equal to 50 μ

m;

the thickest portion of said adhesive agent after being laminate-processed is 50 to 140 μ

m; and

a thickness of an overall card is smaller than, or equal to 340 μ

m.

5. A flexible thin card as claimed in claim 1 wherein:

said first insulating layer is an ultraviolet ray hardening type resin.

6. A flexible thin card as claimed in claim 1 wherein:

both said flexible base board and said flexible substance are made of PET (polyethyleneterephthalate).

7. A flexible thin card as claimed in claim 1 wherein:

both said flexible base board and said flexible substance are transparent PET (polyethyleneterephthalate) sheets; and

an inside surface of each of the PET sheets is design-printed.