Intelligent binning for electrically repairable semiconductor chips
First Claim
1. A system for testing a semiconductor device, the system comprising:
- a support to support the semiconductor device;
test equipment to perform tests of a first type on the semiconductor device to identify failures in the semiconductor device;
processing circuitry to communicate with the test equipment and determine a number of failures and provide signals indicative thereof;
decision circuitry to receive the signals indicative of the number of failures, and considering the number of failures, to designate the semiconductor device for an additional procedure, designate the semiconductor device for repair, or designate the semiconductor device for additional tests of the first type, said decision circuitry designating the semiconductor device for the additional procedure if the number of the identified failures is within a first number set; and
designating the semiconductor device for repair if the number of the identified failures is within a second number set.
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Accused Products
Abstract
The present invention relates to a system and method for testing one or more semiconductor devices (e.g. packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable. The semiconductor device may be binned differently depending on the number of identified failures. The decision circuitry may designate the semiconductor device for an additional procedure, if the number of the identified failures is within a first number set. The decision circuitry may designate the semiconductor device for repair, if the number of the identified failures is within a second number set. The decision circuitry designate the semiconductor device for additional tests of the first type, if the number of the identified failures is within a third number set. The tests of a first type may be a hot sort procedure and the additional tests may be a cold final procedure.
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Citations
42 Claims
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1. A system for testing a semiconductor device, the system comprising:
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a support to support the semiconductor device; test equipment to perform tests of a first type on the semiconductor device to identify failures in the semiconductor device; processing circuitry to communicate with the test equipment and determine a number of failures and provide signals indicative thereof; decision circuitry to receive the signals indicative of the number of failures, and considering the number of failures, to designate the semiconductor device for an additional procedure, designate the semiconductor device for repair, or designate the semiconductor device for additional tests of the first type, said decision circuitry designating the semiconductor device for the additional procedure if the number of the identified failures is within a first number set; and designating the semiconductor device for repair if the number of the identified failures is within a second number set. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A system for testing a semiconductor device, the system comprising:
apparatus performing tests of a first type on the semiconductor device identifying failures in the semiconductor device and determining the number of identified failures, wherein the apparatus alternately; designates the semiconductor device for an additional procedure when the number of the identified failures is within a first number set; designates the semiconductor device for repair when the number of the identified failures is within a second number set; and designates the semiconductor device for additional tests of the first type when the number of the identified failures is within a third number set.
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33. A system for testing a semiconductor device, the system comprising:
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test equipment to perform tests of a first type on the semiconductor device to identify failures in the semiconductor device; processing circuitry to communicate with the test equipment and determine a number of failures and provide signals indicative thereof; and decision circuitry receiving the signals indicative of the number of failures, the decision circuitry determining the number of failures, and considering the number of failures, the decision circuitry designates the semiconductor device for an additional procedure, designates the semiconductor device for repair, or designates the semiconductor device for additional tests of the first type, wherein the decision circuitry classifies failures by class and numbers the identified failures, wherein a total number of identified failures equals a sum of the identified failures for each class, and the decision circuitry considers the total number of identified failures and the number of identified failures in at least one of the classes. - View Dependent Claims (34)
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35. A system for testing a semiconductor device, the system comprising:
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test equipment that is electrically connected to the semiconductor device, wherein the test equipment performs tests of a first type on the semiconductor device identifying failures in the semiconductor device; processing circuitry to communicate with the test equipment and determine a total number of identified failures and classifying the identified failures by class and a number for each class determined, the total number of identified failures equaling a sum of the identified failures for each class; and decision circuitry to designate the semiconductor device for an additional procedure when the number of the total identified failures is within a first number set, the decision circuitry designating the semiconductor device for repair when the number of the total identified failures is within a second number set and the number of identified failures in a predetermined class is within an auxiliary number set, and the decision circuitry performs additional tests of the first type on the semiconductor device when either the total number of the identified failures is within a third number set or the number of identified failures in a predetermined class is within the auxiliary number set.
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36. A method for testing a semiconductor device, the method comprising the steps of:
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performing tests of a first type on the semiconductor device to identify failures in the semiconductor device; determining the number of identified failures; designating the semiconductor device for an additional procedure when the number of the identified failures is within a first number set; determining if the number of identified failures is within the second number set; repairing the semiconductor device when the number of the identified failures is within the second number set; and performing additional tests of the first type on the semiconductor device when the number of the identified failures is within a third number set. - View Dependent Claims (37, 38, 39, 40, 41, 42)
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Specification