Mold for injection molding encapsulation over small device on substrate
First Claim
1. A mold for injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate comprising;
- a base member,a top member including an inlet, anda gate plate, the gate plate including a short gate having an input communicating with the inlet and an output communicating with a cavity shaped to form a package of encapsulating material capable of focusing and reflecting light wherein the gate and the cavity are formed entirely within the gate plate.
1 Assignment
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Accused Products
Abstract
A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.
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Citations
16 Claims
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1. A mold for injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate comprising;
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a base member, a top member including an inlet, and a gate plate, the gate plate including a short gate having an input communicating with the inlet and an output communicating with a cavity shaped to form a package of encapsulating material capable of focusing and reflecting light wherein the gate and the cavity are formed entirely within the gate plate. - View Dependent Claims (2, 3, 4)
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5. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate, the gate plate comprising:
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a cavity formed to enclose the device and shaved to form a package of encapsulating, material capable of focusing and reflecting light, and a short gate having an input for receiving an encapsulating material and an output communicating with the cavity, wherein the gate and the cavity are formed entirely within the gate plate. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A gate plate for use in injection molding a light-transmissive thermoplastic encapsulating material over a set of light emitting diodes mounted directly on a substrate having a hole through the substrate adjacent to each light emitting diode, the gate plate comprising:
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a set of cavities arranged in the form of an alphanumeric display and formed entirely within the gate plate, each cavity shaped to form a package of encapsulating material capable of focusing and reflecting light and to enclose one light emitting diode and extend over its adjacent hole; and a set of short conical gates formed entirely within the gate plate, each gate having an input for receiving an encapsulating material and an output communicating with a cavity. - View Dependent Claims (13, 14)
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15. A gate plate for use in injection molding an encapsulating a thermoplastic material over a plurality of small electronic devices mounted directly on a substrate, two or more of the devices being in close proximity to one another, the gate plate comprising:
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a plurality of cavities, each cavity formed entirely within the gate plate and designed to form a package of encapsulating material capable of focusing and reflecting light and to enclose a single device and a plurality of short gates, each formed entirely within the gate plate and having an input for receiving an encapsulating material and an output communicating with one of the cavities. - View Dependent Claims (16)
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Specification