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Mold for injection molding encapsulation over small device on substrate

  • US 6,139,304 A
  • Filed: 07/17/1998
  • Issued: 10/31/2000
  • Est. Priority Date: 12/10/1996
  • Status: Expired due to Term
First Claim
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1. A mold for injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate comprising;

  • a base member,a top member including an inlet, anda gate plate, the gate plate including a short gate having an input communicating with the inlet and an output communicating with a cavity shaped to form a package of encapsulating material capable of focusing and reflecting light wherein the gate and the cavity are formed entirely within the gate plate.

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