Plasma processing methods and apparatus

• US 6,139,678 A
• Filed: 11/20/1997
• Issued: 10/31/2000
• Est. Priority Date: 11/20/1997
• Status: Expired due to Term

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: Truss Technology L L C
• Inventors: Siniaguine, Oleg
• Primary Examiner(s): Powell, William
• Assistant Examiner(s): GOUDREAU, GEORGE A
• Application Number:
  US08/975,403
• Time in Patent Office: 1,076 Days
• Field of Search: 156/345, 118/730, 118/720, 118/723 ER, 118/723 IR, 118/723 ME, 216/67, 216/68, 216/69, 216/70, 216/71, 427/38, 427/39
• US Class Current: 156/345.55
• CPC Class Codes: C23C 16/4584 the substrate being rotated
• CPC Class Codes: C23C 16/513 using plasma jets
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating
• CPC Class Codes: H01J 2237/20228 Mechanical X-Y scanning
• CPC Class Codes: H01J 2237/31701 Ion implantation
• CPC Class Codes: H01J 37/32743 for introducing the material into processing chamber
• CPC Class Codes: H01J 37/32788 for extracting the material from the process chamber
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/67796 with angular orientation of workpieces H01L21/67787 and H01L21/67793 take precedence
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is asymmetric so that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. In some embodiments, two shuttles are provided for loading and unloading the plasma processing system. One of the shuttles stands empty waiting to unload the processed articles from the system, while the other shuttle holds unprocessed articles waiting to load them into the system. After the plasma processing terminates, the empty shuttle unloads processed articles from the system, takes the articles away, and gets unloaded and reloaded with unprocessed articles. Meanwhile, the other shuttle loads unprocessed articles into the system and the plasma processing begins. Since the plasma processing system does not wait for the first shuttle, the productivity of the system is increased.

Claims

1. An apparatus for processing an article with plasma, the apparatus comprising:

a plasma source for generating the plasma; and

a system for moving the article and the plasma relative to each other, wherein the system comprises a rotational mechanism for rotating the article around a first axis and at the same time rotating the first axis around a second axis;

wherein a plasma footprint (a plasma cross section along which an article surface to be processed with the plasma intersects the plasma) is elongated such that the plasma footprint'"'"'s dimension along a first line through the plasma footprint is longer than the plasma footprint'"'"'s dimension along a second line through the plasma footprint, the second line being perpendicular to the first line; and

wherein the article and the plasma are to move relative to each other so that;

when the first axis is closer to the plasma and the article moves through the plasma, the plasma processes article points closer to the first axis and does not process article points farther from the first axis, and when the first axis is farther from the plasma and the article moves through the plasma, the plasma processes article points farther from the first axis but not article points closer to the first axis;

when the first axis is closer to the plasma and the article moves through the plasma, an angle between (1) the second (shorter dimension) line and (2) a line interconnecting the first axis and the article, is closer to 90°

than when the fist axis is farther from the plasma and the article moves through the plasma, and as a result article points closer to the first axis move shorter distances through the plasma than article points farther from the first axis.

2. The apparatus of claim 1 wherein the moving system is such that the plasma source is stationary but the article moves in and out of the plasma.

3. The apparatus of claim 1 wherein the apparatus is suitable for plasma processing at atmospheric pressure.

4. The apparatus of claim 1 wherein the first axis is spaced from the article.

5. The apparatus of claim 1 wherein:

R1≧

P1/2, where R1 is the distance between the first axis and the closest point on the article surface to be treated with the plasma, and P1 is the longest dimension of the plasma cross-section in a plane in which the article is to move;

R2>

R1, where R2 is the distance between the first and second axes;

R2-R1<

LP<

R2+R1, where LP is the distance between the second axis and the center of the plasma cross-section in the plane in which the article is to move; and

LP+R2>

LS, where LS is the distance between the first axis and the farthest point on the article surface to be treated with the plasma.

6. The apparatus of claim 1 wherein the article surface to be treated with the plasma is larger than the plasma footprint on the article.

7. The apparatus of claim 1 wherein the article is a semiconductor die or wafer.

8. The apparatus of claim 1 in combination with the article.