Method for packaging microsensors

• US 6,140,144 A
• Filed: 04/14/1997
• Issued: 10/31/2000
• Est. Priority Date: 08/08/1996
• Status: Expired due to Term

• Current Assignee: Integrated Sensing Systems Incorporated
• Original Assignee: Integrated Sensing Systems Incorporated
• Inventors: Najafi, Nader, Massoud-Ansari, Sonbol
• Primary Examiner(s): Guay, John
• Assistant Examiner(s): Chambliss, Alonzo
• Application Number:
  US08/839,495
• Time in Patent Office: 1,296 Days
• Field of Search: 257/417, 257/418, 257/419, 257/778, 257/779, 257/780, 438/51, 438/53, 438/54, 438/106, 438/108, 73/706, 73/708, 73/720, 73/721, 73/725, 73/726
• US Class Current: 438/53
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

A method for packaging and protection of sensors, particularly so called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.

Claims

1. A method of packaging a sensor unit having an active face which includes a sensor element on the active face of said sensor unit, said method comprising the steps of:

providing a substrate having a rear surface, a front surface, and electrical connection means on said rear surface;

forming a cavity in said substrate;

locating said sensor unit over said substrate, with said active face facing in the direction of said rear surface of said substrate, and said sensor element over said cavity;

electrically connecting said sensor unit to said electrical connection means;

securing said sensor unit to said substrate;

dispensing an underfill material at an interface between said sensor unit and said substrate;

due to capillary force on said underfill material, drawing said underfill material between said interface such that said underfill material fills at least a portion of said interface between said sensor unit and said substrate without covering said sensor element; and

forming a seal at said interface between said sensor unit and said substrate, said seal completely circumscribing said sensor element and isolating said sensor element and said cavity from said rear surface of said substrate.

2. The method of claim 1 wherein said underfill material completely fills said interface between said sensor unit and said substrate.

3. The method of claim 1 wherein said substrate has formed thereon more than one cavity, and several sensor units are attached to said substrate such that said sensor elements of each sensor unit is located over corresponding cavities.

4. The method of claim 1 wherein said a cavity is formed as an aperture extending completely through said substrate.

5. The method of claim 4 wherein said underfill material is applied at said interface from said rear surface of said substrate.

6. The method of claim 4 wherein said underfill material is applied at said interface from said front side of said substrate through said cavity.

7. The method of claim 4 further comprising the step of securing a screen to said front side of said substrate, such that said screen covers said cavity and protects said sensor element.

8. The method of claim 7 wherein said screen is porous.

9. The method of claim 7 wherein said screen is non-porous.

10. The method of claim 4 further comprising the step of encapsulating within an encapsulant layer that portion of said underfill material adjacent to said sensor element and exposed to said cavity to protect said underfill material.

11. The method of claim 10 further comprising the step of covering said rear surface of said substrate and a surface of said sensor unit opposite of said sensor element with at least one protective layer.

12. The method of claim 10 further comprising the step of covering said rear surface of said substrate and a surface of said sensor unit opposite of said sensor element with at more than one protective layer.

13. The method of claim 10 further comprising the step of covering at least a portion of said underfill material adjacent to said sensor element and exposed to said cavity and of said encapsulant layer with at least one protective layer.

14. The method of claim 13 wherein said protective layer also covers said sensor element and said protective layer is formed sufficiently thin so as to permit operation of said sensor element.

15. The method of claim 13 wherein said protective layer also covers said front surface of said substrate.

16. The method of claim 14 wherein protective layer further covers said front surface of said substrate.

17. The method of claim 15 wherein said protective layer further covers said rear surface of said substrate and a surface of said sensor unit opposite of said sensor element.

18. The method of claim 17 wherein said front and rear surfaces are covered with protective layers of different materials.

19. The method of claim 4 further comprising the step of covering said rear surface of said substrate and a surface of said sensor unit opposite of said sensor element with at least one protective layer.

20. The method of claim 4 further comprising the step of covering said rear surface of said substrate and a surface of said sensor unit opposite of said sensor element with more than one protective layer.

21. The method of claim 4 further comprising the step of covering a portion of said underfill material adjacent to said sensor element and exposed to said cavity with at least one protective layer.

22. The method of claim 21 wherein said protective layer also covers said sensor element and said protective layer is formed sufficiently thin so as to permit operation of said sensor element.

23. The method of claim 21 wherein all of said underfill material adjacent to said sensor element and exposed to said cavity is covered with said protective layer.

24. The method of claim 21 wherein said protective layer also covers said front surface of said substrate.

25. The method of claim 24 further comprising the step of encapsulating within an encapsulant layer all of said underfill material adjacent to said sensor element and exposed to said cavity.

26. The method of claim 24 wherein said step of covering with at least one protective layer also covers said rear surface of said substrate and a surface of said sensor unit opposite of said sensor element.

27. The method of claim 26 wherein said front and rear surfaces are covered with protective layers of different materials. sensor unit opposite of said sensor element.

28. The method of claim 26 further comprising the step of encapsulating within an encapsulant layer all of said underfill material adjacent to said sensor element and exposed to said cavity.

29. The method of claim 21 further comprising the step of encapsulating within an encapsulant layer all of said underfill material adjacent to said sensor element and exposed to said cavity.

30. The method of claim 1 wherein said step of electrically connecting said sensor unit is through flip chip bonding.

31. The method of claim 30 wherein said step of securing said sensor unit to said substrate is through flip chip bonding.

32. The method of claim 30 wherein said step of electrically connecting said sensor unit to said electrical connection means also secures said sensor unit to said substrate.

33. The method of claim 30 wherein at least one of said sensor unit and said substrate are formed with bumps, some of said bumps being used for electrically connecting said sensor unit to said substrate, and others of said bumps being used for securing said sensor unit to said substrate.

34. The method of claim 1 wherein said step of securing said sensor unit to said substrate is through flip chip bonding.

35. The method of claim 4 wherein said step of electrically connecting said sensor unit is through flip chip bonding.

36. The method of claim 35 wherein said step of securing said sensor unit to said substrate is through flip chip bonding.

37. The method of claim 35 wherein said step of electrically connecting said sensor unit to said electrical connection means also secures said sensor unit to said substrate.

38. The method of claim 35 wherein at least one of said sensor unit and said substrate are formed with bumps, some of said bumps being used for electrically connecting said sensor unit to said substrate, and others of said bumps being used for securing said sensor unit to said substrate.

39. The method of claim 4 wherein said step of securing said sensor unit to said substrate is through flip chip bonding.

40. The method of claim 1 further comprising the steps of:

providing electronic circuitry means;

securing said electronic circuitry means to said rear surface of said substrate;

coupling said electronic circuitry means to said sensor unit.

41. The method of claim 40 wherein said electronic circuitry means includes at least one integrated circuit chip secured to said rear surface of said substrate by flip chip bonding.

42. The method of claim 40 wherein said electronic circuitry means includes at least one integrated circuit chip secured to said rear surface of said substrate by wire bonding.

43. The method of claim 40 wherein said electronic circuitry means includes at least one integrated circuit chip secured to rear surface of said substrate by flip chip bonding and at least one integrated circuit chip secured to rear surface of said substrate by wire bonding.

44. The method of claim 4 further comprising the steps of:

providing electronic circuitry means;

securing said electronic circuitry means to said rear surface of said substrate;

coupling said electronic circuitry means to said sensor unit.

45. The method of claim 44 wherein said electronic circuitry means includes at least one integrated circuit chip secured to said rear surface of said substrate by flip chip bonding.

46. The method of claim 44 wherein said electronic circuitry means includes at least one integrated circuit chip secured to said rear surface of said substrate by wire bonding.

47. The method of claim 44 wherein said electronic circuitry means includes at least one integrated circuit chip secured to rear surface of said substrate by flip chip bonding and at least one integrated circuit chip secured to rear surface of said substrate by wire bonding.

48. The method of claim 4 further comprising the step of fabricating said electronic circuitry on said sensor unit along with said sensor element, creating a monolithic sensor unit.

49. The method of claim 4 wherein said sensor unit is a packaged monolithic sensor unit.

50. The method of claim 4 wherein said sensor unit is a microsensor chip.

51. The method of claim 4 wherein said sensor unit is a packaged microsensor unit.

52. The method of claim 4 wherein said sensor unit is a packaged hybrid sensor unit, having at least one microsensor chip and at least one electronic chip.

53. The method of claim 1 wherein said sensor unit is a monolithic sensor unit having said electronic circuitry fabricated on said sensor unit along with said sensor element.

54. The method of claim 1 wherein said sensor unit is a packaged monolithic sensor unit.

55. The method of claim 1 wherein said sensor unit is a microsensor chip.

56. The method of claim 1 wherein said sensor unit is a packaged microsensor unit.

57. The method of claim 1 wherein said sensor unit is a packaged hybrid sensor unit, having at least one microsensor chip and at least one electronic chip.

58. The method of claim 4 wherein said sensor element is a pressure sensor.

59. The method of claim 1 wherein said a cavity is formed as a recess extending less than completely through said substrate.

60. The method of claim 59 wherein said underfill material is applied at said interface from said rear surface of said substrate.

61. The method of claim 59 further comprising the step of encapsulating within a protective layer, a rearwardly exposed portion of said underfill material.

62. The method of claim 61 further comprising the step of covering said rear surface of said substrate and said sensor unit with at least one protective layer.

63. The method of claim 62 wherein said step of covering with at least one protective layer also covers said front surface of said substrate.

64. The method of claim 63 wherein said encapsulating layer is beneath said protective layer.

65. The method of claim 63 wherein said protective layer is beneath said encapsulating layer.

66. The method of claim 63 wherein said front and rear surfaces are covered with different materials.

67. The method of claim 59 further comprising the step of covering said rear surface of said substrate and said sensor unit with at least one protective layer.

68. The method of claim 59 wherein said step of covering with at least one protective layer also covers said front surface of said substrate.

69. The method of claim 59 wherein said step of electrically connecting said sensor unit to step substrate is through flip chip bonding.

70. The method of claim 69 wherein said step of securing said sensor unit to said substrate is through flip chip bonding.

71. The method of claim 69 wherein said step of electrically connecting said sensor unit to said electrical connection means also secures said sensor unit to said substrate.

72. The method of claim 69 wherein at least one of said sensor unit and said substrate are formed with bumps, some of said bumps being used for electrically connecting said sensor unit to said substrate, and others of said bumps being used for securing said sensor unit to said substrate.

73. The method of claim 59 wherein said step of securing said sensor unit to said substrate is through flip chip bonding.

74. The method of claim 59 further comprising the steps of providing electronic circuitry means and securing said electronic circuitry means to said rear surface of said substrate and coupled to said sensor unit.

75. The method of claim 74 wherein said electronic circuitry means includes at least one integrated circuit chip being secured to said rear surface of said substrate by wire bonding.

76. The method of claim 74 wherein said electronic circuitry means includes at least one integration circuit chip being secured to rear surface of said substrate by flip chip bonding and at least one integrated circuit chip being secured to rear surface of said substrate by wire bonding.

77. The method of claim 59 wherein said electronic circuitry means includes at least one integrated circuit chip being secured to said rear surface of said substrate by flip chip bonding.

78. The method of claim 59 wherein said sensor unit is a monolithic sensor unit having said electronic circuitry fabricated on said sensor unit along with said sensor element.

79. The method of claim 59 wherein said sensor unit is a packaged monolithic sensor unit.

80. The method of claim 59 wherein said sensor unit is a microsensor chip.

81. The method of claim 59 wherein said sensor unit is a packaged microsensor chip.

82. The method of claim 59 wherein said sensor unit is a packaged hybrid sensor chip, with at least one microsensor chip and at least one electronic chip.

83. The method of claim 59 wherein said sensor is an accelerometer.

84. The method of claim 59 wherein said sensor is a member of the gyroscope family.

85. A method of packaging a sensor unit having an active face which includes a sensor element on the active face of said sensor, said method comprising the steps of:

providing a substrate having a rear surface, a front surface, and electrical connection means on said rear surface;

forming a cavity in said substrate, said a cavity being formed as an aperture extending completely through said substrate;

locating said sensor unit over said substrate, with said active face facing in the direction of said rear surface of said substrate, and said sensor element over said cavity;

electrically connecting said sensor unit to said electrical connection means;

securing said sensor unit to said substrate;

dispensing an underfill material at an interface between said sensor unit and said substrate;

due to capillary force on said underfill material, drawing said underfill material between said interface such that said underfill material fills at least a portion of said interface between said sensor unit and said substrate without covering said sensor element; and

forming a seal at said interface between said sensor unit and said substrate, said seal completely circumscribing said sensor element and isolating said sensor element and said cavity from said rear surface of said substrate; and

forming a cover over said electronic connection means of said sensor unit, said cover extending from said sensor element at one end and terminating at another end within said underfill material such that said electrical connection means of said sensor unit is isolated from a sensed environment.

86. The method of claim 85 wherein said cover is formed of silicon.

87. The method of claim 85 wherein said cover is formed of boron doped silicon.

88. The method of claim 85 wherein said cover is spaced apart from said electrical connection means so as to not make contact therewith.

89. The method of claim 88 wherein said cover is formed of silicon.

90. The method of claim 88 wherein said cover is formed of boron doped silicon.

91. The method of claim 88 wherein at least one protective layer is deposited on said cover.

92. The method of claim 85 wherein said cover is in contact with said electrical connection means.

93. The method of claim 92 wherein said cover is formed of silicon.

94. The method of claim 92 wherein said cover is formed of boron doped silicon.

95. The method of claim 92 wherein at least one protective layer is deposited on said cover.

96. The method of claim 85 wherein at least one protective layer is deposited on said cover.

97. A method of packaging a sensor unit having an active face which includes a sensor element on the active face of said sensor unit, said method comprising the steps of:

providing a substrate having a rear surface, a front surface, and electrical connection means on said rear surface;

forming a cavity in said substrate, said a cavity being formed as an aperture extending completely through said substrate;

locating said sensor unit over said substrate, with said active face facing in the direction of said rear surface of said substrate, and said sensor element over said cavity;

electrically connecting said sensor unit to said electrical connection means;

securing said sensor unit to said substrate;

dispensing an underfill material at an interface between said sensor unit and said substrate;

due to capillary force on said underfill material, drawing said underfill material between said interface such that said underfill material fills at least a portion of said interface between said sensor unit and said substrate without covering said sensor element; and

forming a seal at said interface between said sensor unit and said substrate, said seal completely circumscribing said sensor element and isolating said sensor element and said cavity from said rear surface of said substrate; and

depositing a protective layer over said electrical connection means of said sensor unit, said protective layer extending from said sensor element at one end and terminating at another end within said underfill material such that said electrical connection means of said sensor unit is isolated from a sensed environment.

98. A method of packaging a sensor unit having an active face which includes a sensor element on said active face of said sensor unit, said method comprising the steps of:

providing a substrate having a rear surface, a front surface, and electrical connection means on said rear surface;

forming a cavity in said substrate, said electrical connection means having at least one end terminating on said portion at least partially defining said cavity;

locating said sensor unit over said cavity with said active face facing in a direction away from said rear surface of said substrate;

securing said sensor unit to said substrate;

electrically connecting said sensor unit to said electrical connection means;

placing a cap on said rear surface of said substrate and over said sensor unit to completely enclose said sensor unit therein, said cap and said portion of said substrate defining said cavity;

securing said cap to said substrate through non-conductive connecting bumps formed on at least one of said cap and said substrate; and

dispensing an underfill material at an interface between said cap and said substrate;

due to the existing capillary force on said underfill material and said interface between said sensor unit and said substrate, drawing said underfill material between said interface whereby said underfill material fills said interface between said sensor unit and said substrate without covering said sensor element, and

forming a seal at said interface between said sensor unit and said substrate, said seal completely circumscribing said sensor element and isolating said sensor element and said cavity from said rear surface of said substrate.

99. The method of claim 98 wherein said cavity extends less than completely through said substrate.

100. The method of claim 98 wherein said sensor element is provided as an accelerometer.

101. The method of claim 98 wherein said sensor element is a member of the gyroscope family.

102. The method of claim 98 further comprising the step of establishing a controlled environment within said cavity beneath said cap.

103. The method of claim 98 further compromising the step of sealing the interface between said substrate and said cap to provide a controlled environment within said cavity.