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Method of making spiral-type RF inductors having a high quality factor (Q)

  • US 6,140,197 A
  • Filed: 08/30/1999
  • Issued: 10/31/2000
  • Est. Priority Date: 08/30/1999
  • Status: Expired due to Term
First Claim
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1. A method of fabricating an inductor in the fabrication of an integrated circuit comprising:

  • providing a metal line overlying a dielectric layer on a semiconductor substrate;

    depositing an intermetal dielectric layer overlying said metal line and said dielectric layer;

    patterning said intermetal dielectric layer whereby a plurality of openings are made through said intermetal dielectric layer to said dielectric layer;

    thereafter depositing an oxide layer overlying said intermetal dielectric layer and capping said plurality of openings thereby forming air gaps within said intermetal dielectric layer;

    forming a metal plug through said oxide layer and said intermetal dielectric layer to said metal line; and

    depositing a metal layer overlying said oxide layer and patterning said metal layer to form a spiral-shaped inductor wherein a portion of said inductor contacts said metal line through said metal plug to complete formation of said inductor in the fabrication of said integrated circuit.

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