Semiconductor device

• US 6,140,697 A
• Filed: 10/12/1999
• Issued: 10/31/2000
• Est. Priority Date: 05/18/1995
• Status: Expired due to Fees

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Hitachi, Ltd.
• Inventors: Usami, Mitsuo, Miyazaki, Masaru, Tsubosaki, Kunihiro
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/417,466
• Time in Patent Office: 385 Days
• Field of Search: 257/679, 257/678, 257/702, 257/723, 257/724
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and highly reliable at a low cost.

Claims

1. An IC card comprising:

a condenser chip having a thickness not greater than 110 μ

m and including a circuit element portion and a condenser portion;

a coil having a thickness of 110 μ

m or less and providing energy to said condenser portion; and

first and second flexible substrates interposing said condenser chip and coil between them, wherein a neutral plane of said IC card is positioned between upper and lower surfaces of said condenser chip.

2. An IC card according to claim 1,

wherein said condenser chip is strengthened by using a plate harder than said first and second substrates.

3. An IC card according to claim 1,

wherein material of said first and second flexible substrates is PET.

4. An IC card according to claim 1,

wherein a photograph of a holder of said IC card is disposed over said condenser chip.

5. An IC card according to claim 1,

wherein said IC card includes plural integrated circuit chips.

6. An IC card according to claim 1,

wherein said condenser chip includes a titanium oxide film as a dielectric film of the condenser.

7. An IC card according to claim 1,

wherein said condenser chip includes a titanium or platinum film as an electrode of the condenser.

8. An IC card according to claim 1,

wherein said coil is printed.

9. An IC card comprising:

a condenser chip having a thickness not greater than 110 μ

m and including a circuit element portion and a condenser portion;

first and second flexible substrates interposing said condenser chip between them, and

a thin plate harder than said first and second flexible substrate, wherein a neutral plane of said IC card is positioned between upper and lower surfaces of said condenser chip.

10. An IC card according to claim 9,

wherein material of said first and second flexible substrates is PET.

11. An IC card according to claim 9,

wherein a photograph of a holder of said IC card is disposed over said condenser chip.

12. An IC card according to claim 9,

wherein said IC card includes plural integrated circuit chips.

13. An IC card according to claim 9,

wherein said condenser chip includes a titanium oxide film as a dielectric film of the condenser.

14. An IC card according to claim 9,

wherein said condenser chip includes a titanium or platinum film as an electrode of the condenser.

15. An IC card comprising:

a condenser chip having a thickness not greater than 110 μ

m and including a circuit element portion and a condenser portion;

first and second flexible substrates interposing said condenser chip between them, and

a photograph disposed over a portion of a surface of at least one of said first and second flexible substrates,

wherein said portion is located at a position which corresponds to a position of said condenser chip, and wherein said condenser chip is disposed in said IC cord such that a neutral plane of said IC card is positioned between upper and lower surfaces of said condenser chip.

16. An IC card according to claim 15,

wherein said condenser chip is strengthened by using a plate harder than said first and second substrates.

17. An IC card according to claim 15,

wherein material of said first and second flexible substrates is PET.

18. An IC card according to claim 15,

wherein said photograph is a photograph of the holder of said IC card.

19. An IC card according to claim 15,

wherein said IC card includes plural integrated circuit chips.

20. An IC card according to claim 15,

wherein said condenser chip includes a titanium oxide film as a dielectric film of the condenser.

21. An IC card according to claim 15,

wherein said condenser chip includes a titanium or platinum film as an electrode of the condenser.