Alignment correction prior to image sampling in inspection systems

• US 6,141,038 A
• Filed: 06/27/1997
• Issued: 10/31/2000
• Est. Priority Date: 10/02/1995
• Status: Expired due to Term

• Current Assignee: KLA Instruments, Corporation
• Original Assignee: KLA Instruments, Corporation
• Inventors: Young, Scott A., Babian, Fred E., Szabo, Nicholas, Kroeze, Roger, Douglas, Kent E., Chadwick, Curt H.
• Primary Examiner(s): LEE, Y YOUNG
• Application Number:
  US08/884,466
• Time in Patent Office: 1,222 Days
• Field of Search: 348/87, 348/61, 348/86, 348/88, 348/92, 348/94, 348/95, 348/125-130
• US Class Current: 348/87
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.

Claims

1. A method for providing a coarse alignment between a first image signal and a second image signal for a substrate on an x/y stage of an inspection machine defining x and y directions, said inspection machine having a fixed pixel size and pixel grid that is correlated to positions of said x/y stage, for each selected x position in the x direction during scanning of said substrate, said substrate in the y direction, said coarse alignment method comprising the steps of:

a. storing a first swath signal of said first image signal in a first memory;

b. determining x and y position coordinates in the x and y directions, respectively, of a first pixel of said first swath signal of said first image signal of step a. relative to boundaries of a pixel of said pixel grid;

c. scanning across a first pattern on said substrate to determine a first swath signal of said second image signal;

d. determining x and y position coordinates of a first pixel of said first swath signal of said second image signal detected in step c. relative to the boundaries of a pixel of said pixel grid in which said first pixel of said first swath of said second image signal is detected;

e. calculating the positional offset of said x and y coordinates of said first pixel of said first swath of said second image signal within said pixel of said pixel grid of step d. from said x and y coordinates of said first pixel of said first image signal within said pixel of said pixel grid from step b.; and

f. performing a running alignment of said first pixel of each swath signal of said second image signal within said pixel grid in relation to said first pixel of said first image signal using said positional offset calculated in step e. by advancing or retarding said x path to correct for said x positional offset, and advancing or retarding the scan in the y direction to correct for said y positional offset to realign each swath signal of said second image signal with each swath signal of said first image signal.

2. A method as in claim 1 wherein said first image signal of step a. is stored in a database.

3. A method as in claim 1 wherein:

said method, preceding step a., further includes the step of;

g. sequentially scanning swaths across a first pattern on said substrate to determine each swath signal of said first image signal; and

said said pattern in step c. is a second pattern on said substrate.

4. A method as in claim 3 wherein in step b. said x and y position coordinates of said first pixel of said first image signal is relative to the boundaries of said first pixel grid pixel in which said first pixel of said first image signal is detected.

5. A method as in claim 1 wherein in step f.:

scanning in said y direction is performed by varying the angle of a tilt mirror; and

said advancing or retarding the scan in the y direction is performed by advancing or retarding the angle of said tilt mirror.

6. A method as in claim 1 wherein in step f.:

scanning in said y direction is performed by varying the time delay of a laser; and

said advancing or retarding the scan in the y direction is performed by advancing or retarding the time delay of said laser.

7. An apparatus to provide coarse alignment between a first image signal with a second image signal of a pattern on a substrate, to generate an image pattern said apparatus comprising:

an x-y stage defining x and y directions to transport said substrate with a fixed pixel size and pixel grid that is correlated to positions of said x/y stage;

a scanner to image said pattern on said substrate in sequential swaths, and to generate electronic sequential swath signals of said second image signal as said substrate is scanned in said y direction at successive x locations of said pattern;

a FIFO memory coupled to said scanner to sequentially receive said swath signals of said second image signal;

a pixel memory to receive, and store therein, sequential swath signals of said first image signal;

an alignment computer;

coupled to said pixel memory to receive a first swath signal of said first image signal therefrom for performing a first process step of determining x and y position coordinates of a first pixel of said first swath signal of said first image signal relative to boundaries of a pixel of said pixel grid;

coupled to said scanner to sequentially receive swath signals of said second image signal therefrom and to perform a second process step of determining x and y position coordinates of a first pixel of said first swath signal of said second image signal relative to the boundaries of a pixel of said pixel grid in which said first pixel of said first swath of said second image signal is detected;

performing a third process step of calculating the positional offset of said x and y coordinates of said first pixel of said first swath signal of said second image signal within said pixel of said pixel grid in which said first pixel of said first swath signal of said second image signal is detected from said x and y coordinates of said first pixel of said first image signal within said pixel of said pixel grid in which said first pixel of said first swath signal of said first image signal is detected; and

an alignment corrector coupled to said alignment computer to receive said positional offset and coupled to said pixel memory;

performing a fourth process step of a running alignment of said first pixel of each swath signal of said second image signal within said pixel grid in relation to said first pixel of said first image signal using said positional offset of said third process step by advancing or retarding the scan in said x direction to correct for said x positional offset, and advancing or retarding the scan in the y direction to correct for said y positional offset, to realign each swath signal of said second image signal with each swath signal of said first image signal.

8. An apparatus as in claim 7 wherein:

said apparatus further includes a sensor disposed to receive from said scanner, and to convert, said imaged pattern to said second image signal;

said scanner includes;

a tilt mirror having an axis of rotation in the y direction to reflect said pattern from said substrate to said sensor; and

a mirror position actuator coupled to said tilt mirror and said alignment computer to control the position of said tilt mirror in response to a signal from said alignment computer to shift the x position of said second image signal with respect to the x position of said first image signal.

9. An apparatus as in claim 8 wherein:

said substrate is partially transparent having a first and a second surface, with said first surface closest to said tilt mirror; and

said apparatus further includes a light source spaced apart from said second surface of said substrate.

10. An apparatus as in claim 8 wherein:

said pattern is a second pattern on said substrate; and

said tilt mirror also reflects a first pattern from said substrate to said sensor.

11. An apparatus as in claim 7 wherein said scanner includes:

a laser positioned to direct a laser beam toward a surface of said substrate;

an acusto-optic deflector/driver positioned between said laser and said substrate and coupled to said alignment computer to shift the position of said laser beam on said surface of said substrate in response to a signal from said alignment computer to shift the x position of said second optical image with respect to the x position of said first pixel of said first swath signal of said first image signal; and

a beamsplitter positioned between said acusto-optic deflector/driver and said substrate to pass therethrough said laser beam from said acusto-optic deflector/driver to said substrate and to reflect light reflected from said surface of said substrate to said scanner.

12. An apparatus as in claim 7 wherein:

said substrate is partially transparent having a first and a second surface;

said scanner includes;

a laser positioned to direct a laser beam toward said first surface of said substrate; and

an acusto-optic deflector/driver positioned between said laser and said substrate and coupled to said alignment computer to shift the position of said laser beam on said surface of said substrate in response to a signal from said alignment computer to shift the x position of said second image signal with respect to the x position of said first image signal; and

said apparatus further includes a sensor spaced-apart from said second surface of said substrate disposed to receive from said scanner, and to convert, said imaged pattern to said second image signal.

13. An apparatus as in claim 7 wherein:

said pattern is a second pattern;

said scanner serially obtains a first image signal from a first pattern on said substrate as a first sequence of swath images and said second image signal from said second pattern on said substrate as a second sequence of swath images, with a time delay between receipt of corresponding swath images of said first and second sequences of swath images;

said scanner serially receives said sequences of said first and second swath images interlaced with each other and serially converts said interlaced sequences of first and second swath images of said first and second image signals with said time delay between each corresponding pair of swath signals; and

said alignment computer receives said first swath signals of said first image signal from said pixel memory.

14. An apparatus as in claim 7 wherein said pixel memory is a database into which said first image signal is prestored.

15. An apparatus to inspect a substrate utilizing a first image signal and a second image signal of a pattern on said substrate, to generate an image pattern said apparatus comprising:

an x-y stage defining x and y directions to transport said substrate with a fixed pixel size and pixel grid that is correlated to positions of said x-y stage;

a scanner to image said pattern on said substrate in sequential swaths, and to generate electronic sequential swath signals of said second image signal as said substrate is scanned in said y direction at successive x locations of said pattern;

a FIFO memory coupled to said scanner to sequentially receive said swath signals of said second image signal;

a pixel memory to receive, and store therein, sequential swath signals of said first image signal;

an alignment computer;

coupled to said pixel memory to receive a first swath signal of said first image signal therefrom for performing a first process step of determining x and y position coordinates of a first pixel of said first swath signal of said first image signal relative to boundaries of a pixel of said pixel grid;

coupled to said scanner to sequentially receive swath signals of said second image signal therefrom and to perform a second process step of determining x and y position coordinates of a first pixel of said first swath signal of said second image signal relative to the boundaries of a pixel of said pixel grid in which said first pixel of said first swath of said second image signal is detected;

performing a third process step of calculating the positional offset of said x and y coordinates of said first pixel of said first swath signal of said second image signal within said pixel of said pixel grid in which said first pixel of said first swath signal of said second image signal is detected from said x and y coordinates of said first pixel of said first image signal within said pixel of said pixel grid in which said first pixel of said first swath signal of said first image signal is detected;

an alignment corrector coupled to said alignment computer to receive said positional offset and coupled to said pixel memory;

performing a fourth process step of a running alignment of said first pixel of each swath signal of said second image signal within said pixel grid in relation to said first pixel of said first image signal using said positional offset of said third process step by advancing or retarding the scan in said x direction to correct for said x positional offset, and advancing or retarding the scan in the y direction to correct for said y positional offset, to realign each swath signal of said second image signal with each swath signal of said first image signal; and

a defect detector coupled to said alignment corrector and said FIFO memory to detect and identify defects in said second image signal as aligned by comparison with said first image signal.

16. An apparatus as in claim 15 wherein:

said apparatus further includes a sensor disposed to receive from said scanner, and to convert, said image of said pattern to said second image signal;

said pattern is a second pattern;

said scanner serially obtains a first image signal from a first pattern on said substrate and said second image signal from said second pattern on said substrate, with a time delay between receipt of said first and second image signals;

said sensor serially receives said first and second optical images from said scanner and serially converts said first and second optical images to said first and second image signals with said time delay therebetween;

said memory is a pixel memory having serially connected first and second sections, each of said first and second sections having an input port and an output port, with the input port of said first section being an input port of said pixel memory, the output port of said first section being a first output port of said pixel memory and connected to the input port of said second section, and the output port of said second section form a second output port of said pixel memory, said first section having a fixed length and said second section having a controllable length ranging from zero to n integer pixel units, said input port of said pixel memory coupled to said sensor to serially receive said first and second image signals; and

said alignment computer receives said first image signal from said pixel memory.

17. An apparatus as in claim 15 wherein said pixel memory is a database into which said first image signal is prestored.

18. An apparatus as in claim 15 wherein:

said apparatus further includes a sensor disposed to receive from said scanner, and to convert, said imaged pattern to said second image signal;

said scanner includes;

a tilt mirror having an axis of rotation in the y direction to reflect said pattern from said substrate to said sensor; and

a mirror position actuator coupled to said tilt mirror and said alignment computer to control the position of said tilt mirror in response to a signal from said alignment computer to shift the x position of said pattern with respect to the x position of said first image signal.

19. An apparatus as in claim 18 wherein:

said substrate is partially transparent having a first and a second surface, with said first surface closest to said tilt mirror; and

said apparatus further includes a light source spaced apart from said second surface of said substrate.

20. An apparatus as in claim 18 wherein:

said pattern is a second pattern on said substrate; and

a tilt mirror also reflects said first pattern from said substrate to said sensor.

21. An apparatus as in claim 15 wherein:

said apparatus further includes a sensor disposed to receive from said scanner, and to convert, said image of said pattern to said second image signal;

said scanner includes;

a laser positioned to direct a laser beam toward a surface of said substrate;

an acusto-optic deflector/driver positioned between said laser and said substrate and coupled to said alignment computer to shift the position of said laser beam on said surface of said substrate in response to a signal from said alignment computer to shift the x position of said second optical image with respect to the x position of said first image signal; and

a beamsplitter positioned between said acusto-optic deflector/driver and said substrate to pass therethrough said laser beam from said acusto-optic deflector/driver to said substrate and to reflect light reflected from said surface of said substrate to said sensor.

22. An apparatus as in claim 15 wherein:

said substrate is partially transparent having a first and a second surface;

said scanner includes;

a laser positioned to direct a laser beam toward said first surface of said substrate; and

an acusto-optic deflector/driver positioned between said laser and said substrate and coupled to said alignment computer to shift the position of said laser beam on said surface of said substrate in response to a signal from said alignment computer to shift the x position of said second image signal with respect to the x position of said first image signal; and

said apparatus further includes a sensor spaced-apart from said second surface of said substrate disposed to receive from said scanner, and to convert, said imaged pattern to said second image signal.

23. An apparatus as in claim 15 wherein:

said scanner includes a tilt mirror to scan said pattern in said y direction by varying the angle of said tilt mirror; and

said advancing or retarding the scan in the y direction is performed by advancing or retarding the angle of said tilt mirror under control of said alignment corrector.

24. A method for inspecting a substrate utilizing a first image signal and a second image signal of a pattern on said substrate with said substrate on an x/y stage of an inspection machine, said inspection machine having a fixed pixel size and pixel grid that is correlated to positions of said x/y stage defining x and y directions, for each selected x position in the x direction during scanning of said substrate, a swath is scanned across said substrate in the y direction, said inspection method comprising the steps of:

a. storing a first swath signal of said first image signal in a first memory;

b. determining x and y position coordinates in the x and y directions, respectively, of a first pixel of said first swath signal of said first image signal of step a. relative to boundaries of a pixel of said pixel grid;

c. scanning a first swath across said pattern on said substrate to determine a first swath signal of said second image signal;

d. determining x and y position coordinates of a first pixel of said first swath signal of said second image signal detected in step c. relative to the boundaries of a pixel of said pixel grid in which said first pixel of said first swath of said second image signal is detected;

e. calculating the positional offset of said x and y coordinates of said first pixel of said first swath of said second image signal within said pixel of said pixel grid of step d. from said x and y coordinates of said first pixel of said first image signal within said pixel of said pixel grid from step b.;

f. performing a running alignment of said first pixel of each swath signal of said second image signal within said pixel grid in relation to said first pixel of said first image signal using said positional offset calculated in step e. by advancing or retarding said x path to correct for said x positional offset, and advancing or retarding the scan in the y direction to correct for said y positional offset to realign each swath signal of said second image signal with each swath signal of said first image signal;

g. sequentially storing each swath signal of said first image signal in said first memory;

h. sequentially scanning said substrate and storing each realigned swath signal of said second image signal in a second memory; and

i. sequentially comparing each swath signal of said first image signal with a corresponding realigned swath signal of said second image signal to determine if defects are present in said pattern on said substrate that corresponds to said second image signal.

25. A method as in claim 24 wherein:

said method, preceding step a., further includes the step of;

j. sequentially scanning swaths across a first pattern on said substrate to determine each swath signal of said first image signal; and

said pattern in step c. is a second pattern.

26. A method as in claim 25 wherein in step b. said x and y position coordinates of said first pixel of said first image signal is relative to the boundaries of said first pixel grid pixel in which said first pixel of said first image signal is detected.

27. A method as in claim 24 wherein in step f.:

scanning in said y direction is performed by varying the time delay of a laser; and

said advancing or retarding the scan in the y direction is performed by advancing or retarding the time delay of said laser.

28. A method as in claim 24 wherein said first image signal of step a. is stored in a database.