Organic positive temperature coefficient thermistor and manufacturing method therefor

• US 6,143,206 A
• Filed: 01/28/1999
• Issued: 11/07/2000
• Est. Priority Date: 06/24/1998
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Handa, Tokuhiko, Yoshinari, Yukie
• Primary Examiner(s): Kopec, Mark
• Assistant Examiner(s): Hamlin, Derrick G.
• Application Number:
  US09/238,919
• Time in Patent Office: 649 Days
• Field of Search: 252/511, 252/500, 252/510, 252/512, 252/513, 252/518.1, 219/541, 219/546, 219/547, 219/553, 264/104, 264/234, 264/347, 338/22 R
• US Class Current: 252/500
• CPC Class Codes: H01C 7/027 consisting of conducting or semi-conducting material dispersed in a non-conductive organic material

Abstract

An organic positive temperature coefficient thermistor comprising a thermoplastic polymer matrix, a low-molecular organic compound having a melting point that is equal to or greater than 40° C. and less than 100° C. and conductive particles, each having spiky protuberances, is obtained by crosslinking a milled mixture of these components with a silane coupling agent comprising a vinyl group or a (meth)acryloyl group and an alkoxy group. This organic positive temperature coefficient thermistor has sufficiently low resistance at room temperature and a large rate of resistance change between an operating state and a non-operating state, and can be operated at less than 100° C. with a reduced temperature vs. resistance curve hysteresis, ease of control of operating temperature, and high performance stability.

Claims

1. An organic positive temperature coefficient thermistor comprising a thermoplastic polymer matrix, a low-molecular organic compound having a melting point that is equal to or greater than 40°

C. and less than 100°

C. and conductive particles, each having spiky protuberances, wherein;

a mixture of said thermoplastic polymer matrix, said low-molecular organic compound and said conductive particles is crosslinked with a silane coupling agent comprising a vinyl group or a (meth)acryloyl group and an alkoxy group.

2. The organic positive temperature coefficient thermistor according to claim 1, wherein said low-molecular organic compound has a weight-average molecular weight of 1,000 or lower.

3. The organic positive temperature coefficient thermistor according to claim 1, wherein said low-molecular organic compound is a petroleum wax.

4. The organic positive temperature coefficient thermistor according to claim 1, wherein said conductive particles, each having spiky protuberances, are interconnected in a chain form.

5. The organic positive temperature coefficient thermistor according to claim 1, wherein said thermoplastic polymer matrix is a polyolefin.

6. The organic positive temperature coefficient thermistor according to claim 5, wherein said polyolefin is a high-density polyethylene.

7. The organic positive temperature coefficient thermistor according to claim 6, wherein said high-density polyethylene has a melt flow rate of 3.0 g/10 min. or less.

8. The organic positive temperature coefficient thermistor according to claim 1, wherein said silane coupling agent is vinyltrimethoxysilane or vinyltriethoxysilane.

9. The organic positive temperature coefficient thermistor according to claim 1, which has an operating temperature of less than 100°

C.

10. A method of preparing an organic positive temperature coefficient thermistor as recited in claim 1, wherein a thermoplastic polymer matrix, a low-molecular organic compound having a melting point that is equal to or greater than 40°

C. and less than 100°

C. and conductive particles, each having spiky protuberances, are milled together into a milled mixture, and said milled mixture is then crosslinked with a silane coupling agent comprising a vinyl group or a (meth)acryloyl group and an alkoxy group.