Electronic chip package
First Claim
Patent Images
1. A chip package comprising:
- a laminated substrate having at least one conductive layer; and
at least one dielectric layer bonded to the conductive layer, the dielectric layer having a glass transition temperature Tg greater than 200°
C. a volumetric coefficient of thermal expansion 75 ppm/°
C. and the dielectric layer is an expanded organic material having an inorganic filler material; and
a semiconductor device electrically attached to the laminated substrate.
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Abstract
An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature Tg greater than 200° C. and a volumetric coefficient of thermal expansion of ≦75 ppm/°C. A semiconductor device is electrically attached to the laminated substrate.
95 Citations
11 Claims
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1. A chip package comprising:
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a laminated substrate having at least one conductive layer; and
at least one dielectric layer bonded to the conductive layer, the dielectric layer having a glass transition temperature Tg greater than 200°
C. a volumetric coefficient of thermal expansion 75 ppm/°
C. and the dielectric layer is an expanded organic material having an inorganic filler material; anda semiconductor device electrically attached to the laminated substrate. - View Dependent Claims (2, 3, 4, 5, 6, 9, 10)
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7. A chip package comprising:
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a laminated substrate having at least one conductive layer and at least one dielectric layer bonded to the conductive layer, the dielectric layer including expanded polytetrafluoroethylene, and wherein the dielectric layer has a glass transition temperature (Tg) greater than 200°
C. and a volumetric coefficient of thermal expansion of ≦
75 ppm/°
C.; anda semiconductor device electrically attached to the laminated substrate. - View Dependent Claims (11)
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8. A chip package comprising:
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a laminated substrate having at least one conductive layer and at least one dielectric layer bonded to the conductive layer, the dielectric layer including expanded polytetrafluoroethylene, an organic resin and an inorganic filler which is a particulate, and wherein the dielectric layer has a glass transition temperature (Tg) greater than 200°
C.; anda semiconductor device electrically attached to the laminated substrate.
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Specification