Silicon micro-machined accelerometer using integrated electrical and mechanical packaging

• US 6,145,380 A
• Filed: 12/04/1998
• Issued: 11/14/2000
• Est. Priority Date: 12/18/1997
• Status: Expired due to Term

• Current Assignee: Alliedsignal Inc. (Honeywell International Inc.)
• Original Assignee: Alliedsignal Inc. (Honeywell International Inc.)
• Inventors: MacGugan, Douglas C.
• Primary Examiner(s): Kwok, Helen C.
• Application Number:
  US09/205,429
• Time in Patent Office: 711 Days
• Field of Search: 73/493, 73/514.12, 73/514.16, 73/514.21, 73/514.23, 73/514.32, 73/514.33, 73/514.34, 73/514.36, 73/514.29
• US Class Current: 73/493
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/097 by vibratory elements
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends

Abstract

An integrated sensor package formed using low temperature co-fired ceramic assembly techniques and method for manufacturing same.

Claims

1. A sensor package comprising:

plurality of multi-layer hybrid substrates;

a measuring device mounted on one of said substrates;

a circuit integrated onto one of said multi-layer hybrid substrates for driving and sensing said measuring device;

a housing formed of said substrates enclosing said measuring device and said driving and sensing circuit; and

an interface for inputting power and drive signals and outputting measuring device signals.

2. The sensor package recited in claim 1 wherein said substrates and said measuring device comprise a multichip module.

3. The sensor package recited in claim 2 wherein said multichip module is assembled using low temperature co-fired ceramic (LTCC) assembly techniques.

4. The sensor package recited in claim 3 wherein said measuring device is an acceleration sensor.

5. The sensor package recited in claim 4 wherein said acceleration sensor is a micro-machined silicon sensor.

6. The sensor package recited in claim 1 wherein at least one of said multi-layer hybrid substrates comprises a plurality of separate layers and said circuit is integrated into said layers of said substrate.

7. The sensor package recited in claim 6 wherein said circuit is formed on said substrate using thick film processing.

8. The sensor package recited in claim 1 wherein said substrates have a first coefficient of thermal expansion and said measuring device has a second coefficient of thermal expansion substantially equal to said first coefficient of thermal expansion.

9. The sensor package recited in claim 1 wherein said substrates are formed of a material selected from the group consisting of ceramic and fiberglass reinforced plastic.

23. The sensor package recited in claim 1 wherein said sensor package is assembled using conventional re-flow lid sealing techniques.

10. A sensor package comprising:

a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals;

a measuring device mounted on a first one of said substrates;

a circuit integrated into a second one of said substrates for driving and sensing said measuring device;

a housing formed of a third and fourth one of said substrates enclosing said measuring device and said driving and sensing circuit; and

an interface integrated into one of said substrates for inputting power and drive signals and outputting signals from said measuring device.

11. The sensor package recited in claim 10 wherein said plurality of multi-layer hybrid substrates comprises:

an upper hybrid cover;

an upper hybrid;

a lower hybrid; and

a lower hybrid cover.

12. The sensor package recited in claim 11 wherein at least one of said substrates includes integrated electrical signal routing.

13. The sensor package recited in claim 12 wherein said upper hybrid cover includes a header.

14. The sensor package recited in claim 12 wherein said upper hybrid includes a mounting flange.

15. The sensor package recited in claim 12 wherein said lower hybrid includes means for mounting said measuring device.

16. A sensor package comprising:

a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals, said plurality of substrates including;

an upper hybrid cover,

an upper hybrid,

a lower hybrid, and

a lower hybrid cover;

a measuring device mounted on one of said substrates;

a circuit integrated into one of said substrates for driving and sensing said measuring device;

a housing formed of at least two of said substrates enclosing said measuring device and said driving and sensing circuit; and

an interface integrated into one of said hybrid covers for inputting power and drive signals and outputting signals from said measuring device.

17. The sensor package recited in claim 16 wherein said substrates and said measuring device comprise a multichip module.

18. The sensor package recited in claim 17 wherein said multichip module is assembled using low temperature co-fired ceramic (LTCC) assembly techniques.

19. The sensor package recited in claim 18 wherein said measuring device is an acceleration sensor.

24. The sensor package recited in claim 16 wherein said sensor package is assembled using conventional re-flow lid sealing techniques.

20. An accelerometer package comprising:

a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals;

an acceleration sensor mounted on one of said substrates;

a circuit integrated into one of said substrates for driving and sensing said acceleration sensor;

a housing formed of at least two of said substrates enclosing said acceleration sensor and said driving and sensing circuit; and

means integrated into one of said substrates for inputting power and drive signals and outputting signals from said acceleration sensor.

21. A method of packaging a sensor comprising the steps of:

a) forming a die carrier and a circuit on a substrate layer for mounting of a measuring device;

b) forming a circuit on a substrate layer for driving and sensing said measuring device;

c) forming an interface on a substrate layer for inputting power and drive signals and outputting measuring device signals;

d) forming a housing on a substrate layer for said measuring device and said circuit;

e) pressing and low temperature co-firing said substrate layers to form components of a sensor package;

f) aligning and stacking together said substrate layers; and

g) affixing together said aligned and stacked together substrate layers to form said sensor package.

22. The method recited in claim 21 wherein said step of pressing and co-firing said aligned and stacked together substrate layers to form a sensor package defines a method of low temperature co-fired ceramic (LTCC) assembly.