×

Silicon micro-machined accelerometer using integrated electrical and mechanical packaging

  • US 6,145,380 A
  • Filed: 12/04/1998
  • Issued: 11/14/2000
  • Est. Priority Date: 12/18/1997
  • Status: Expired due to Term
First Claim
Patent Images

1. A sensor package comprising:

  • plurality of multi-layer hybrid substrates;

    a measuring device mounted on one of said substrates;

    a circuit integrated onto one of said multi-layer hybrid substrates for driving and sensing said measuring device;

    a housing formed of said substrates enclosing said measuring device and said driving and sensing circuit; and

    an interface for inputting power and drive signals and outputting measuring device signals.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×