Silicon micro-machined accelerometer using integrated electrical and mechanical packaging
First Claim
Patent Images
1. A sensor package comprising:
- plurality of multi-layer hybrid substrates;
a measuring device mounted on one of said substrates;
a circuit integrated onto one of said multi-layer hybrid substrates for driving and sensing said measuring device;
a housing formed of said substrates enclosing said measuring device and said driving and sensing circuit; and
an interface for inputting power and drive signals and outputting measuring device signals.
1 Assignment
0 Petitions
Accused Products
Abstract
An integrated sensor package formed using low temperature co-fired ceramic assembly techniques and method for manufacturing same.
-
Citations
24 Claims
-
1. A sensor package comprising:
-
plurality of multi-layer hybrid substrates; a measuring device mounted on one of said substrates; a circuit integrated onto one of said multi-layer hybrid substrates for driving and sensing said measuring device; a housing formed of said substrates enclosing said measuring device and said driving and sensing circuit; and an interface for inputting power and drive signals and outputting measuring device signals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 23)
-
-
10. A sensor package comprising:
-
a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals; a measuring device mounted on a first one of said substrates; a circuit integrated into a second one of said substrates for driving and sensing said measuring device; a housing formed of a third and fourth one of said substrates enclosing said measuring device and said driving and sensing circuit; and an interface integrated into one of said substrates for inputting power and drive signals and outputting signals from said measuring device. - View Dependent Claims (11, 12, 13, 14, 15)
-
-
16. A sensor package comprising:
-
a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals, said plurality of substrates including; an upper hybrid cover, an upper hybrid, a lower hybrid, and a lower hybrid cover; a measuring device mounted on one of said substrates; a circuit integrated into one of said substrates for driving and sensing said measuring device; a housing formed of at least two of said substrates enclosing said measuring device and said driving and sensing circuit; and an interface integrated into one of said hybrid covers for inputting power and drive signals and outputting signals from said measuring device. - View Dependent Claims (17, 18, 19, 24)
-
-
20. An accelerometer package comprising:
-
a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals; an acceleration sensor mounted on one of said substrates; a circuit integrated into one of said substrates for driving and sensing said acceleration sensor; a housing formed of at least two of said substrates enclosing said acceleration sensor and said driving and sensing circuit; and means integrated into one of said substrates for inputting power and drive signals and outputting signals from said acceleration sensor.
-
-
21. A method of packaging a sensor comprising the steps of:
-
a) forming a die carrier and a circuit on a substrate layer for mounting of a measuring device; b) forming a circuit on a substrate layer for driving and sensing said measuring device; c) forming an interface on a substrate layer for inputting power and drive signals and outputting measuring device signals; d) forming a housing on a substrate layer for said measuring device and said circuit; e) pressing and low temperature co-firing said substrate layers to form components of a sensor package; f) aligning and stacking together said substrate layers; and g) affixing together said aligned and stacked together substrate layers to form said sensor package. - View Dependent Claims (22)
-
Specification