Transparent, flexible permeability barrier for organic electroluminescent devices

• US 6,146,225 A
• Filed: 07/30/1998
• Issued: 11/14/2000
• Est. Priority Date: 07/30/1998
• Status: Expired due to Term

• Current Assignee: InnoLux Corporation
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Sheats, James R., Hueschen, Mark R., Seaward, Karen L., Roitman, Daniel B., Briggs, George Andrew Davidson
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US09/126,689
• Time in Patent Office: 838 Days
• Field of Search: 445/24, 445/58
• US Class Current: 445/24
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 59/874 including getter material or desiccant

Abstract

A barrier for preventing water or oxygen from a source thereof from reaching a device that is sensitive to water or oxygen. The barrier is constructed by depositing a first polymer layer between the device and the source. An inorganic layer is deposited on the first polymer layer of the device by plasma enhanced chemical vapor deposition utilizing an electron cyclotron resonance source ECR-PECVD. A second polymer layer is then deposited on the inorganic layer. The inorganic layer is preferably an oxide or nitride. A second barrier layer having a compound that absorbs oxygen or water can be placed between the inorganic layer and the device to further retard the passage of oxygen or water. The present invention is particularly useful in encapsulating electroluminescent displays.

Claims

1. A method for preventing water or oxygen from a source thereof reaching a device, said method comprising the steps of:

depositing a first polymer layer between said device and said source;

depositing an inorganic layer on said first polymer layer of said device by ECR-PECVD; and

depositing a second polymer layer on said inorganic layer.

2. The method of claim 1 wherein said inorganic layer comprises an oxide.

3. The method of claim 2 wherein said oxide comprises an aluminum oxide or a silicon oxide.

4. The method of claim 1 wherein said inorganic layer comprises a nitride.

5. The method of claim 4 wherein said nitride comprises an aluminum nitride or a silicon nitride.

6. The method of claim 1 wherein said inorganic layer comprises an oxynitride.

7. The method of claim 6 wherein said oxynitride comprises an aluminum oxynitride or a silicon oxynitride.

8. The method of claim 1 further comprising the step of depositing a layer of material that absorbs oxygen or water between said inorganic layer and said device.

9. The method of claim 8 wherein said absorbing material comprises a metal uniformly dispersed in an oxide or nitride.

10. The method of claim 1 wherein said inorganic layer further comprises a material that absorbs oxygen or water.

11. The method of claim 10 wherein said absorption material comprises a metal.