Graphite-fiber enhanced molded plastic for electronic enclosures

• US 6,147,301 A
• Filed: 06/04/1998
• Issued: 11/14/2000
• Est. Priority Date: 06/04/1998
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Bhatia, Rakesh
• Primary Examiner(s): Cuchlinski, Jr., William A.
• Assistant Examiner(s): MANCHO, RONNIE M
• Application Number:
  US09/090,709
• Time in Patent Office: 894 Days
• Field of Search: 174/35 R, 174/35 GC, 174/35 MS, 428/148, 428/141, 428/143
• US Class Current: 174/388
• CPC Class Codes: H05K 9/009 comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24372 Particulate matter
• CPC Class Codes: Y10T 428/24413 Metal or metal compound

Abstract

A technique for fabricating an improved electronic enclosure. The electronic enclosure is made of graphite fibers dispersed directionally (non-homogeneous) in an absolac/polycarbonate (ABS/PC) resin mix, of which the composition is molded to form the the plastic enclosure. The graphite concentration is highest along the interior surface of the enclosure to provide improved heat transfer, as well as adequate EMI/RFI shielding. However, the graphite concentration decrease along the thickness, wherein at the outer surface, the graphite concentration level is zero. The directional variation in the graphite loading allows high graphite loading at the interior surface of the enclosure, but retains lower loading at other regions along the thickness so that rigidity and impact resistance are retained for the enclosure.

Claims

1. An enclosure comprising:

a rigid support housing for an electronic component, said rigid support housing having an interior surface and an exterior surface;

a base portion of said rigid support housing; and

side portions of said rigid support housing,

said enclosure fabricated from a plastic material having an additive directionally distributed to have a varying concentration along a thickness of said plastic material,

said directional distribution having a higher additive concentration along said interior surface than along said exterior surface of said enclosure to remove heat generated by said electronic component,

said higher additive concentration being approximately 50% by volume to said plastic material so as to enhance thermal conductivity.

5. The enclosure of claim 1 wherein the additive concentration by volume is approximately 0% near the exterior surface.

2. The enclosure of claim 19 wherein the additive concentration along the interior surface of the enclosure is of sufficient concentration in the plastic material to provide shielding for electrical or magnetic interference.

3. The enclosure of claim 2 wherein the additive is comprised of graphite fibers.

4. The enclosure of claim 3 wherein the plastic material is molded from a resin comprised of absolac and polycarbonate.

6. An improved electronic enclosure formed to provide a rigid support housing for an electronic component, said enclosure fabricated from a plastic material, said improvement comprising an additive directionally distributed along a thickness of the plastic material, said directional distribution having a varying additive concentration with a higher additive concentration proximal to an interior surface of said enclosure than along an exterior surface of said enclosure, said higher additive concentration being sufficient to provide shielding for electrical or magnetic interference and being approximately 50% by volume to said plastic material to correspond with approximately 100 Watts per meter Kelvin of thermal conductivity.

7. The improvement of claim 6 wherein the additive is comprised of graphite fibers.

8. The improvement of claim 7 wherein the plastic material is molded from a resin comprised of absolac and polycarbonate.

9. The improvement of claim 6 wherein the additive concentration by volume is approximately 0% near the exterior surface.

10. An enclosure for housing an electronic component comprising:

a floor plate;

a plurality of side plates coupled to said floor plate;

said floor and side plates forming a rigid support housing for housing the electronic component;

said floor and side plates being fabricated from a plastic material in which an additive is directionally distributed along a thickness of the plastic material to enhance thermal conductivity, the directional distribution having a varying additive concentration, such that a higher additive concentration resides proximal to an interior surface of said enclosure and decreases along the thickness until a minimum additive concentration resides proximal to an exterior surface of said enclosure, said higher additive concentration being approximately 50% by volume to said plastic material so as to enhance thermal conductivity.

11. The enclosure of claim 10 wherein the additive concentration proximal to the interior surface of the enclosure is of sufficient concentration in the plastic material to provide shielding for electrical or magnetic interference.

12. The enclosure of claim 11 wherein the additive is comprised of graphite fibers.

13. The improvement of claim 12 wherein the plastic material is molded from a resin comprised of absolac and polycarbonate.

14. The improvement of claim 13 wherein the additive concentration by volume is approximately 0% near the exterior surface.