Packaging design for light emitting diode

• US 6,147,367 A
• Filed: 03/26/1998
• Issued: 11/14/2000
• Est. Priority Date: 12/10/1997
• Status: Expired due to Term

• Current Assignee: Transpacific IP Group Limited
• Original Assignee: Industrial Technology Research Institute
• Inventors: Liu, Huey-Fen, Yang, Hung-Pin, Hsu, Jung-Tsung, Hwang, Rong-Yih
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/048,710
• Time in Patent Office: 964 Days
• Field of Search: 257/81, 257/74, 257/88, 257/99
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/075 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED package assembly comprising two or more light emitting diode dies within an epoxy housing such that a wider light emitting angle with a higher light intensity everywhere around the package including its bottom part is obtained. The LED package can be a substitute for bulb illumination or serving some decorative functions. Furthermore, the LED has low power consumption, a tough body and a long working life. Moreover, a cluster of these LEDs in a large display screen is capable of enhancing clarity of vision and the range of observation from a few meters to a few kilometers away.

Claims

1. A packaging design for light emitting diodes comprising:

an epoxy housing;

a plurality of light emitting diode dies;

a plurality of metallic pins;

a plurality of flat panel bases a the upper end of the metallic pins for mounting the light emitting diode dies wherein the plurality of flat panel bases include conical or hemi-ellipsoid reflecting mirrors; and

a plurality of metallic wires for connecting a terminal of the light emitting diode die to the metallic pin.

2. The packaging design of claim 1, wherein the light emitting diode die is mounted onto the flat panel base by a method such as soldering, gluing using a gold epoxy, gluing using a silver epoxy or mounting with Indium.

3. The packaging design of claim 1, wherein the LED package includes using two light emitting diode dies and two flat panel bases.

4. The packaging design of claim 3, wherein the LED package includes using three metallic pins where one metallic pin acts an anode pin and the remaining two act as cathode pins.

5. The packaging design of claim 4, wherein the flat panel bases are on the upper part of the respective cathode pins, where the first flat panel base faces the top of the housing while the second flat panel faces the side of the housing.

6. The packaging design of claim 4, wherein the two light emitting diode dies mount onto the respective flat panel bases.

7. The packaging design of claim 3, wherein the light emitting diode die is mounted onto the flat panel base by a method such as soldering, gluing using a gold paste, gluing using a silver paste or mounting with Indium.

8. The packaging design of claim 4, wherein the flat panel bases are on the upper part of the respective cathode pins, where the first flat panel base faces one side of the housing while the second flat panel faces the opposite side of the housing.

9. The packaging design of claim 3, wherein the LED package includes using two metallic pins where one metallic pin acts an anode pin and the other one acts as cathode pins.

10. The packaging design of claim 9, wherein two flat panel bases for mounting two light emitting diode dies are located at the upper part of the first metallic pin and that the light emitting directions for the two light emitting diode dies are perpendicular to the metallic pin.

11. The packaging design of claim 1, wherein the LED package includes using three light emitting diode dies and three flat panel bases.

12. The packaging design of claim 11, wherein the LED package includes using two metallic pins where one metallic pin acts an anode pin and the other one acts as cathode pins.

13. The packaging design of claim 12, wherein one flat panel base is located on the top end of the cathode pin and two other flat panel bases are back-to-back and located on each side in the upper part of the cathode pin, where the first flat panel base faces the top of the housing while the two flat panel bases face opposite sides of the housing.

14. The packaging design of claim 13, wherein the two back-to-back flat panel bases on each side of the upper part of the cathode pin can have symmetrical tilt angles smaller than 90°

with respect to a line parallel to the vertical cathode pin direction.

15. The packaging design of claim 12, wherein the three light emitting diode dies mount onto the three flat panel bases respectively.

16. The packaging design of claim 11, wherein the light emitting diode die is mounted onto the flat panel base by a method such as soldering, gluing using a gold paste, gluing using a silver paste or mounting with Indium.

17. The packaging design of claim 11, wherein the epoxy housing is a spherical shaped epoxy housing.

18. The packaging design of claim 17, wherein the LED package includes using two metallic pins where one metallic pin acts an anode pin and the other one acts as cathode pins.

19. The packaging design of claim 18, wherein one flat panel base is located on the top end of the cathode pin and two flat panel bases are located in the upper sides of the cathode pin backing on each other, where the first flat panel base faces the top of the housing while the two flat panel bases face opposite sides of the housing.

20. The packaging design of claim 18, wherein the three light emitting diode dies mount onto the three flat panel bases respectively.

21. The packaging design of claim 18, wherein the light emitting diode die is mounted onto the flat panel base by a method such as soldering, gluing using a gold paste, gluing using a silver paste or mounting with Indium.

22. The packaging design of claim 1, wherein the LED package includes using four light emitting diode dies and four flat panel bases.

23. The packaging design of claim 22, wherein the LED package includes using two metallic pins where one metallic pin acts an anode pin and the other one acts as cathode pins.

24. The packaging design of claim 23, wherein the upper part of the first metallic pin includes four mutually perpendicular flat panel bases formed into a square or a rectangle and having a hollow in the middle, each flat panel base has a light emitting diode die mounted on it, the second metallic pin is placed in the middle, and having an electrode at the upper end for electrically connecting with the respective terminals of the four light emitting diode dies by metallic wires.

25. The packaging design of claim 23, wherein to be light emitting diode die is mounted onto the flat panel base by a method such as soldering, gluing using a gold paste, gluing using a silver paste or mounting with Indium.

26. The packaging design of claim 1, wherein the LED package includes using five light emitting diode dies and five flat panel bases.

27. The packaging design of claim 26, wherein the LED package includes using three metallic pins where one metallic pin acts an anode pin and the remaining two act as cathode pins.

28. The packaging design of claim 27, wherein the upper part of the first metallic pin includes four mutually perpendicular flat panel bases formed into a square or a rectangle having a hollow in the middle, each flat panel base has a light emitting diode die mounted on it, the other two metallic pins are placed in the middle with one metallic pin having a flat panel base at its upper end for mounting the fifth light emitting diode die, and the other metallic pin has an electrode at the upper end for electrically connecting with the respective terminal of the five light emitting diode dies by metallic wires.

29. The packaging design of claim 27, wherein the light emitting diode die is mounted onto the flat panel base by a method such as soldering, gluing using a gold paste, gluing using a silver paste or mounting with Indium.

30. A light emitting diode cluster formed by clustering a plurality of light emitting diodes serving as a lamp or big display screen, wherein the light emitting diode package comprises:

an epoxy housing;

a plurality of light emitting diode dies;

a plurality of metallic pins;

a plurality of flat panel bases a the upper end of the metallic pins for mounting the light emitting diode dies wherein each of the plurality of light emitting diode dies and the plurality of flat panel bases are located so as to face in a different direction; and

a plurality of metallic wires for connecting a terminal of the light emitting diode die to the metallic pin.