Image sensor package with image plane reference
First Claim
1. An integrated circuit package for housing an integrated circuit die, said package providing a reference plane in relation to an image plane of said die, said package comprising:
- a transparent window;
a lower frame; and
an upper frame bonded to said lower frame, said lower frame configured as a main housing with wiring traces on a front side and a recessed shelf for receiving a recessed cover on a rear side, said upper frame configured as a standoff for said transparent window, said upper frame configured to provide a stopping surface for positioning an integrated circuit die.
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Accused Products
Abstract
An integrated circuit package that provides a reference plane relative to an image plane of an image sensor is described. The reference plane is aligned with respect to the image plane of the sensor such that the sensor can be mounted in an optical assembly quickly, easily, accurately, and inexpensively. The package can be thin, allowing for use of the package in retrofit applications such as using the packaged image sensor in a conventional 35 mm camera. The package includes a standoff frame for mounting a transparent window. The package includes reference members, such as rails, that define the reference plane. The package provides a desired tolerance between the reference plane and image plane of the sensor when the sensor is bonded into the package. The window can be flat or configured as a lens to focus the image on the image plane. The window can be configured such that its front (outer) face becomes the image plane of the packaged image sensor.
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Citations
15 Claims
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1. An integrated circuit package for housing an integrated circuit die, said package providing a reference plane in relation to an image plane of said die, said package comprising:
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a transparent window; a lower frame; and an upper frame bonded to said lower frame, said lower frame configured as a main housing with wiring traces on a front side and a recessed shelf for receiving a recessed cover on a rear side, said upper frame configured as a standoff for said transparent window, said upper frame configured to provide a stopping surface for positioning an integrated circuit die. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated circuit package for housing an integrated circuit die, said package providing a reference plane in relation to an image plane of said die, said package comprising:
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a transparent window; and a frame having an upper surface and a lower surface, said lower surface having a recessed shelf for receiving a recessed cover, a first portion of said upper surface configured as a standoff for said window, a portion of said lower surface configured as a stopping surface, a second portion of said upper surface configured as a first reference member, and a third portion of said upper surface configured as a second reference member. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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Specification