Wafer test fixture using a biasing bladder and methodology
First Claim
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1. A test apparatus for testing a wafer comprising:
- a wafer probe of a material with substantially the same thermal expansion characteristics as the wafer being tested, the wafer probe including a plurality of flexible tabs of a flat shape and positioned generally horizontally between the load board and the wafer probe;
a load board coupled to the wafer probe by the flexible tabs;
a bladder for biasing the wafer probe; and
testing means for testing the wafer using a reduced pin test methodology.
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Abstract
A wafer test and burn-in fixture and methodology including a wafer probe having flexible tabs and a load board coupled to the wafer probe using the flexible tabs. The fixture also includes a bladder which biases the wafer probe to contact a wafer. A temperature control apparatus is provided to control the temperature of the wafer probe and the wafer. Tests are performed on the wafer using built-in self tests or wrap wiring tests.
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Citations
37 Claims
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1. A test apparatus for testing a wafer comprising:
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a wafer probe of a material with substantially the same thermal expansion characteristics as the wafer being tested, the wafer probe including a plurality of flexible tabs of a flat shape and positioned generally horizontally between the load board and the wafer probe; a load board coupled to the wafer probe by the flexible tabs; a bladder for biasing the wafer probe; and testing means for testing the wafer using a reduced pin test methodology. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 33, 34, 35)
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16. A test apparatus for testing a wafer comprising:
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a wafer probe including flexible tabs, the wafer probe of a material with substantially the same thermal expansion characteristics as the wafer being tested; a load board coupled to the wafer probe using the flexible tabs of a generally flat shape to be positioned horizontally between the load board and the wafer probe; a bladder which biases the wafer probe to contact the wafer; and temperature control means for controlling the temperature of the wafer probe and the wafer. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 32, 36)
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27. A method for testing a wafer comprising the steps of:
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(a) providing a wafer probe which is of a material with substantially the same thermal expansion characteristics as the wafer being tested, the wafer probe including a plurality of flexible tabs for coupling the wafer probe to a load board, the flexible tabs being of a generally flat shape and positioned generally horizontally between the load board and the wafer probe; (b) biasing the wafer probe to contact the wafer; and (c) testing the wafer using at least one of a built-in self test and a warp wiring test. - View Dependent Claims (28, 29, 30, 31, 37)
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Specification