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Spring-ring micromechanical device

  • US 6,147,790 A
  • Filed: 05/13/1999
  • Issued: 11/14/2000
  • Est. Priority Date: 06/02/1998
  • Status: Active Grant
First Claim
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1. An improved micromechanical device comprising:

  • a substrate;

    a rigid deflectable member suspended over said substrate; and

    at least one spring supported above said substrate and spaced apart from said rigid deflectable member, said spring operable to resist deflection of said rigid deflectable member when deflection of said rigid deflectable member creates contact between said rigid deflectable member and said spring.

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