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Direct temperature sensing of a semiconductor device semiconductor device

  • US 6,149,299 A
  • Filed: 12/11/1997
  • Issued: 11/21/2000
  • Est. Priority Date: 12/11/1997
  • Status: Expired due to Term
First Claim
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1. An apparatus for measuring the temperature of a device of interest, comprising:

  • a first substrate on which is formed the device of interest;

    a temperature sensor formed on the first substrate, the temperature sensor including a first junction diode and a second junction diode; and

    a temperature sensor signal processing circuit formed on a second substrate and configured to have as an input a signal provided by the temperature sensor, wherein the temperature sensor signal processing circuit further comprises;

    a circuit operable to provide a first current level to the temperature sensor and to measure a first output voltage at an output node of the temperature sensor, and to provide a second current level to the temperature sensor and to measure a second output voltage at the output node of the temperature sensor; and

    a switch operable to selectively route the first current level through the first junction diode and the second current level through the second junction diode, and to selectively route the first current level through the second junction diode and the second current level through the first junction diode.

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