Encapsulation method of a polymer or organic light emitting device

• US 6,150,187 A
• Filed: 07/27/1998
• Issued: 11/21/2000
• Est. Priority Date: 11/20/1997
• Status: Expired due to Term

• Current Assignee: Uniloc 2017 LLC (FIG LLC (d/b/a Fortress Investment Group LLC))
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Jung, Sang Don, Hwang, Do Hoon, Zyung, Tae Hyoung
• Primary Examiner(s): Bowers, Charles
• Assistant Examiner(s): BEREZNY, NEMA O
• Application Number:
  US09/122,755
• Time in Patent Office: 848 Days
• Field of Search: 438/116, 438/126, 438/127, 438/761, 438/780, 438/902, 438/928, 438/956, 438/28, 438/35, 438/26, 438/22, 257/79, 257/99, 257/100, 257/680, 257/790
• US Class Current: 438/26
• CPC Class Codes: H10K 50/844 Encapsulations

Abstract

The present invention relates to the encapsulation for extending the lifetime of a flexible organic or polymer light emitting device and, more particularly, to encapsulation by sealing with multiple polymer films to prevent the penetration of oxygen and moisture into an organic or polymer light emitting device. Due to the encapsulation of polymer light emitting device with the multiple polymer films, exposure to moisture and oxygen are prevented, which are causes of device degradation. When using a plastic substrate whose the thermal endurance is high, simultaneously, it has a thermal endurance effect to the Joule heat during device operation. Accordingly, there can be fabricated an organic or polymer light emitting display whose lifetime is extended through the encapsulation of an organic of polymer light emitting device with multiple polymer films.

Claims

1. An encapsulation method of a polymer or organic light emitting device, said method comprising the steps of:

forming an organic or polymer light emitting device having a metal layer serving as a metallic electrode, on a transparent substrate; and

wrapping said device with multiple polymer films without contacting said metal layer to protect said organic or polymer light emitting device from oxygen and moisture.

2. The encapsulation method of a polymer or organic light emitting device according to claim 1, wherein said multiple polymer films are formed by integrating a simultaneous oxygen and moisture preventing film, an oxygen preventing film and a moisture preventing film in series.

3. The encapsulation method of polymer or organic light emitting device according to claim 1, wherein said transparent substrate includes a polymer of polyethyl naphthalate derivatives.

4. The encapsulation method of a polymer or organic light emitting device according to claim 1, wherein said transparent substrate includes a thin rubber film of polyurethane derivatives.

5. The encapsulation method of a polymer or organic light emitting device according to claim 2, wherein said simultaneous oxygen and moisture preventing film includes a polymer of polyethyl naphthalate derivatives.

6. The encapsulation method of a polymer or organic light emitting device according to claim 2, wherein said oxygen preventing film includes one of the polymer thin films which include polyvinyl alcohol derivatives, polyvinyl acetate derivatives, polyvinyl alcohol acetate derivatives and is formed by a spin coating, doctor-blading or by attaching film with an adhesive.

7. The encapsulation method of polymer or organic light emitting device according to claim 2, wherein said moisture preventing film includes a polymer thin film of polyethylene derivatives and is formed by spin coating, doctor-blading, or by attaching film with an adhesive.