Semiconductor device sealed with resin, and its manufacture

• US 6,150,194 A
• Filed: 07/30/1998
• Issued: 11/21/2000
• Est. Priority Date: 12/04/1996
• Status: Expired due to Fees

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Sakaguchi, Noboru, Hizume, Toru, Miyajima, Yoshinori
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): JONES, JOSETTA I
• Application Number:
  US09/117,551
• Time in Patent Office: 845 Days
• Field of Search: 438/118, 438/126
• US Class Current: 438/118
• CPC Class Codes: H01L 2224/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A semiconductor device is provided which is capable of improving the productivity, the reliably, and the shielding of exposed parts such as leads or others and preventing chipping. The semiconductor device comprises a semiconductor chip 10, an insulating member 20 adhered onto an electrode terminal-forming surface 10a of a semiconductor chip 10, a circuit pattern 30 having at one end a land 32 to be connected to an external connection terminal, provided on the insulating member 20, and at the other end a lead 34 to be connected to an electrode terminal 12, a cover member 52 having an outer size larger than that of the semiconductor chip 10 to cover not only the electrode terminal-forming surface 10a and the lead 34 but also the outer edge of the semiconductor chip 10, and a resin shield 50 formed by filling a resinous sealant into a gap between the electrode terminal-forming surface 10a and the cover member 52 and curing the same, which shields the electrode terminal-forming surface 10a, the lead 34 and a side surface of the semiconductor chip 10.

Claims

1. A method for producing a semiconductor device, comprising the steps of:

adhering an insulating member on an electrode terminal-forming surface without covering an electrode terminal;

connecting the electrode terminal to a lead formed at one end of a circuit pattern provided on the insulating member and having at the other end a terminal to be connected to an external connection terminal;

attaching a cover member having an outer size larger than that of the semiconductor chip to cover not only the electrode terminal-forming surface and the lead but also the outer edge of the semiconductor in an area outside a portion wherein the insulating member, the circuit pattern or others are laminated, so that a gap is defined between the electrode terminal-forming surface and the cover member; and

filling a resinous sealant into the gap and curing the same to form a resin shield.

2. A method for producing a semiconductor device as defined by claim 1, wherein the cover member is removed after the resin shield has been formed.

3. A method for producing a semiconductor device , comprising the steps of:

adhering an insulating member on an electrode terminal-forming surface without covering an electrode terminal;

connecting the electrode terminal to a lead formed at one end of a circuit pattern provided on the insulating member and having at the other end a terminal to be connected to an external connection terminal;

attaching a cover member having an outer size larger than that of the semiconductor chip to cover not only the electrode terminal-forming surface and the lead but also the outer edge of the semiconductor in an area outside a portion wherein the insulating member, the circuit pattern or others are laminated, so that a gap is defined between the electrode terminal-forming surface and the cover member;

filling a resinous sealant into the gap and curing the same to form a resin shield; and

cutting the resin shield at a position outside of an outer edge of the semiconductor chip to define an outer side surface of the resin shield.

4. A method as defined by claim 3, wherein said cover member is attached to said semiconductor chip so as to cover an outer surface of said insulating member, so that for a terminal-forming area of said terminal which is to be connected to the external connection terminal is exposed.