Assembly of optical components optically aligned and method for making this assembly

• US 6,151,173 A
• Filed: 08/12/1999
• Issued: 11/21/2000
• Est. Priority Date: 12/13/1996
• Status: Expired due to Term

• Current Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Original Assignee: Commissariat a L'Energie Atomique (AES Corporation)
• Inventors: Massit, Claude, Marion, Fran.cedilla.ois, Mottier, Patrick
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): THOMPSON, TIMOTHY J
• Application Number:
  US09/319,269
• Time in Patent Office: 467 Days
• Field of Search: 359/811, 438/27, 438/29, 358/14
• US Class Current: 359/811
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G03F 7/70825 Mounting of individual elements, e.g. mounts, holders or supports workpiece or mask holders G03F7/707
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

An optically aligned optical component assembly. Each optical component has a plurality of first fastening studs. The surface of a support is provided with second fastening studs, where the second studs are formed with parts made of a material that can be soldered to the studs. The optical components are assembled onto the support using corresponding parts. The volume of each part is determined so that the components are optically aligned along a direction that is perpendicular to the surface of the support. This is especially used in the field of microelectronics.

Claims

1. An optical apparatus, comprising:

a support comprising support fastening studs;

optical components each having an optical axis and each comprising component fastening studs; and

bumps comprising a meltable material, each of said bumps being provided between one of said support fastening studs and one of said component fastening studs, wherein;

said bumps have a height so that the optical axes of the optical components are aligned with each other along a direction perpendicular to a surface of said support, the height of each of said bumps being dependent on the size of a support fastening stud fastened to said each of said bumps,

said support fastening studs and said component fastening studs are wettable by said meltable material,

said support comprises areas surrounding said support fastening studs and not wettable by said meltable material, and

said optical components comprise areas surrounding said component fastening studs and not wettable by said meltable material.

2. The apparatus of claim 1, wherein:

at least one of the optical components is an optoelectronic component,

the support further comprises electric lines electrically connected to the optoelectronic component by corresponding bumps, and

said corresponding bumps and corresponding support fastening studs and component fastening studs being electrically conductive.

3. The apparatus of claim 2, wherein the electric lines are integrated into the support.

4. The apparatus of claim 2, wherein the electric lines are provided on the surface of the support.

5. A process for assembling optical components on a support, each of said optical components having an optical axis, comprising:

forming component fastening studs on each of said optical components;

forming support fastening studs on a surface of the support;

forming parts with a meltable material on said support fastening studs and having a height depending on the size of said support fastening studs;

positioning said optical component so that said component fastening studs are positioned on said parts; and

melting said meltable material, thereby fastening said optical components to said support so that the optical axes of the optical components are aligned with each other along a direction that is perpendicular to the surface of the support.

6. The process of claim 5, wherein forming said parts comprises forming parts having a substantially cylindrical shape and a same thickness.

7. The process of claim 5, wherein forming said parts comprises:

melting said meltable material into more or less pellet shape parts;

hardening said more or less pellet shape parts; and

melting said more or less pellet shape parts to said support fastening studs.

8. The process of claim 6, wherein forming said parts comprises forming parts having a substantially cylindrical shape by photolithography.

9. The process of claim 5, wherein forming said parts comprises forming parts with a material selected from the group consisting of indium and a tin-lead alloy.

10. The process of claim 5, wherein:

at least one of the components is an optoelectronic component,

support fastening studs, component fastening studs and parts corresponding to said optoelectronic component are electrically conductive, and

further comprising forming electric lines on the support, said electric lines being electrically connected to the optoelectronic component by the corresponding parts.