Multi-layer ceramic substrate and method for producing the same

• US 6,153,290 A
• Filed: 12/28/1998
• Issued: 11/28/2000
• Est. Priority Date: 01/06/1998
• Status: Expired due to Fees

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Sunahara, Hirofumi
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/221,466
• Time in Patent Office: 701 Days
• Field of Search: 361/762, 361/763, 361/793, 428/209, 428/210, 29/832, 156/89
• US Class Current: 428/210
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

The present invention provides a method for producing a high-density multi-layer ceramic substrate with stable characteristics, the substrate incorporating therein a passive component such as a high-precision capacitor or inductor. The method comprises the steps of providing compact blocks containing a green ceramic functional material to form the passive components; providing a composite green laminate having a plurality of ceramic green sheets comprising a ceramic insulating material and in which the compact blocks are built in pre-disposed spaces and a paste containing a metal inducing, during firing, oxidation reaction accompanied by expansion is provided in space between inside walls of the spaces and the compact blocks; firing the composite green laminate in a state in which the laminate is sandwiched by the sheet-like supports formed of green ceramics that cannot be sintered at the sintering temperature, so as to prevent shrinkage of the laminate; and removing the unsintered sheet-like supports.

Claims

1. A multi-layer ceramic substrate, comprising:

a laminate containing at least one internal space and comprising a plurality of laminated ceramic insulating material layers and at least one wiring conductor;

a passive component disposed in the space in the laminate and electrically connected to the wiring conductor;

the passive component comprising a monolithically sintered compact block of passive component green ceramic functional material;

an layer interposed at least between the passive component and a wall of the laminate space extending in a direction perpendicular to lamination plane of the laminate;

the interposed layer comprising a fired metal which during firing induced an oxidation reaction accompanied by expansion and optionally an inorganic compound.

2. The multi-layer ceramic substrate according to claim 1, wherein the interposed layer is disposed on a wall of the laminate space extending in a direction parallel to the lamination planes of the laminate or on such wall and a face extending therefrom.

3. The multi-layer ceramic substrate according to claim 1, wherein the metal is at least one member selected from the group consisting of Al, Si, Ti, Fe, Cu, Mo, W, Cr and Zn.

4. The multi-layer ceramic substrate according to claim 1, wherein the inorganic compound is present and comprises ceramic, glass or a mixture of ceramics and glass.

5. The multi-layer ceramic substrate according to claim 1, wherein the proportion by weight of the metal and the inorganic compound is about 100/0 to 5/95.

6. The multi-layer ceramic substrate according to claim 1, wherein the passive component comprises a capacitor or an inductor.

7. The multi-layer ceramic substrate according to claim 1, wherein the compact block has a layer structure and contains a multi-layer internal conductor.

8. The multi-layer ceramic substrate according to claim 1, wherein the ceramic functional material of the compact block comprises glass ceramic or a mixture of glass and ceramic.

9. The multi-layer ceramic substrate according to claim 1, wherein each ceramic layer of the laminate comprises glass and the proportion by weight of the glass and a different ceramic is about 100/0 to 5/95.

10. The multi-layer ceramic substrate according to claim 1, wherein the wiring conductor comprises at least one member selected from the group consisting of Ag, Ag--Pt alloy, Ag--Pd alloy, Au, Ni, Pd, Pt, W, Mo and Cu.

11. A multi-layer ceramic substrate, comprising:

a laminate containing at least one internal space and comprising a plurality of laminated ceramic insulating material layers and at least one wiring conductor comprising at least one member selected from the group consisting of Ag, Ag--Pt alloy, Ag--Pd alloy, Au, Ni, Pd, Pt, W, Mo and Cu;

a passive component disposed in the space in the laminate and electrically connected to the wiring conductor;

the passive component comprising a monolithically sintered, multi-layered compact block of passive component precursor green ceramic functional material containing a multi-layer internal conductor;

an layer interposed at least between the passive component and a wall of the laminate space extending in a direction perpendicular to lamination plane of the laminate;

the interposed layer comprising a fired metal which during firing induced an oxidation reaction accompanied by expansion and is at least one member selected from the group consisting of Al, Si, Ti, Fe, Cu, Mo, W, Cr and Zn and an inorganic compound comprising glass in a proportion by weight of the metal to inorganic compound of about 100/0 to 5/95.

12. A method for producing a multi-layer ceramic substrate including a laminate having a plurality of laminated ceramic layers formed of a ceramic insulating material and a wiring conductor, and a passive component built into the laminate and being wired through the wiring conductor, comprising the steps of:

providing a composite green laminate containing an interior space and comprising a wiring conductor and a plurality of laminated ceramic green sheets, a passive component compact block comprising a green ceramic functional material in the interior space, wherein the ceramic insulating material of the composite green laminate and the ceramic functional material of the compact block are different, and a paste comprising a metal which during firing induces an oxidation reaction accompanied by expansion and optionally an inorganic compound within a gap at least between an inside wall of the space extending perpendicular to the lamination planes of the laminate and the compact block;

disposing on each of the principal surfaces located at both ends of the composite green laminate with respect to a direction perpendicular to the lamination planes of the laminate, a sheet-like support of a green ceramic which is not sintered at the firing temperature of the composite green laminate;

firing the composite green laminate in a state in which the composite green laminate is sandwiched by the sheet-like supports; and

removing the unsintered sheet-like supports.

13. The method according to claim 12, wherein in the step of providing a composite green laminate, said paste is provided in said space between said compact block and an inside wall of the laminate space extending in a direction parallel to the lamination plane of the laminate, or on said inside wall and a face extending therefrom.

14. The method according to claim 12, wherein a load is applied perpendicular to the lamination plane of the composite green laminate via the sheet-like support during the step of firing the composite green laminate.

15. The method according to claim 12, wherein the step of firing the composite green laminate is performed at about 1000°

C. or less.

16. The method according to claim 15, wherein the sheet-like support comprises alumina or zirconia.

17. The method according to claim 12, wherein the metal is at least one member selected from the group consisting of Al, Si, Ti, Fe, Cu, Mo, W, Cr and Zn.

18. The method according to claim 12, wherein the inorganic compound or the ceramic functional material contained in the compact block, or both, comprises ceramic, glass or a mixture of ceramic and glass.

19. The method according to claim 12, wherein the proportion by weight of the metal and the inorganic compound is about 100/0 to 5/95.

20. The method according to claim 12, wherein the compact block provided has a layered structure and has a multi-layer internal conductor therein.

21. The method according to claim 20, wherein the wiring conductor or the internal conductor, or both, comprises at least one member selected from the group consisting of Ag, Ag--Pt alloy, Ag--Pd alloy, Au, Ni, Pd, Pt, W, Mo and Cu.

22. The method according to claim 12, wherein the ceramic insulating material contained in the ceramic green sheet provided in the composite laminate comprises glass and the proportion by weight of the glass and another ceramic in the ceramic green sheet is about 100/0 to 5/95.