Epoxy/thermoplastic photocurable adhesive composition
First Claim
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1. An article comprising:
- a) a curable composition in the form of a film formed by mixing components comprising a molten mixture including;
i) from about 20 to about 80 weight percent of a curable epoxy resin,ii) from about 20 to about 80 weight percent of a thermoplastic ethylene-vinyl acetate copolymer resin, andiii) an effective amount of a photocatalyst for the curable epoxy resin, such that the total of components i) and ii) is 100 weight percent, the mixture of components i), ii), and iii) is a homogeneous mixture and wherein the composition is free from hydrocarbon polyolefins; and
b) a release liner or a backing attached to said film.
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Abstract
A curable composition comprising a) a curable epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer resin, and an effective amount of a photocatalyst for the curable epoxy resin, wherein the composition is free from hydrocarbon polyolefins and wherein the sum of a) and b) is 100 weight percent.
66 Citations
3 Claims
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1. An article comprising:
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a) a curable composition in the form of a film formed by mixing components comprising a molten mixture including; i) from about 20 to about 80 weight percent of a curable epoxy resin, ii) from about 20 to about 80 weight percent of a thermoplastic ethylene-vinyl acetate copolymer resin, and iii) an effective amount of a photocatalyst for the curable epoxy resin, such that the total of components i) and ii) is 100 weight percent, the mixture of components i), ii), and iii) is a homogeneous mixture and wherein the composition is free from hydrocarbon polyolefins; and b) a release liner or a backing attached to said film. - View Dependent Claims (2, 3)
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Specification
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Current Assignee3M Innovative Properties Company (3M Company)
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Original Assignee3M Innovative Properties Company (3M Company)
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InventorsKarim, Naimul, George, Clayton A., Meyer, Christopher M.
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Primary Examiner(s)Seidleck, James J.
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Assistant Examiner(s)McClendon, Sanza L.
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Application NumberUS09/515,441Time in Patent Office273 DaysField of Search522/122, 522/100, 522/102, 522/113, 522/134, 522/143, 524/379, 5/388, 5/430, 525/107, 523/457, 523/420, 523/143, 428/413, 428/424.2, 428/424.8US Class Current428/413CPC Class CodesC08L 2666/04 Macromolecular compounds ac...C08L 2666/22 Macromolecular compounds no...C08L 63/00 Compositions of epoxy resin...C09J 131/04 Homopolymers or copolymers ...C09J 163/00 Adhesives based on epoxy re...Y10T 428/31511 Of epoxy etherY10T 428/31573 Next to addition polymer of...Y10T 428/31587 Hydrocarbon polymer [polyet...
