Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same
First Claim
1. A method of fabricating a circuit on a substrate, comprising:
- forming a matrix of immediately adjacent vias through a flexible electrically insulative substrate;
filling a selected plurality of immediately adjacent vias within said matrix with an electrically conductive material; and
forming a first electrically conductive element on a top surface of said substrate and a second electrically conductive element on a bottom surface of said substrate, wherein said selected plurality of immediately adjacent vias are disposed between said first and said second electrically conductive elements such that a conductive path between said first and said second electrically conductive elements is established.
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Accused Products
Abstract
An interlayer connection for electrically connecting first and second conductive elements and reducing interlayer registration requirements is disclosed. The interlayer connection includes a first layer including a first electrically conductive element, a second layer including a second electrically conductive element, and a third layer disposed between the first layer and the second layer. The third layer includes an electrically insulative portion having a matrix of immediately adjacent vias therethrough. A selected plurality of immediately adjacent vias within the matrix are disposed between the first and the second electrically conductive elements and contain electrically conductive material forming a conductive path between the first and the second electrically conductive elements.
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Citations
8 Claims
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1. A method of fabricating a circuit on a substrate, comprising:
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forming a matrix of immediately adjacent vias through a flexible electrically insulative substrate; filling a selected plurality of immediately adjacent vias within said matrix with an electrically conductive material; and forming a first electrically conductive element on a top surface of said substrate and a second electrically conductive element on a bottom surface of said substrate, wherein said selected plurality of immediately adjacent vias are disposed between said first and said second electrically conductive elements such that a conductive path between said first and said second electrically conductive elements is established. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification