Methods and apparatuses for removing material from discrete areas on a semiconductor wafer
First Claim
1. A method of removing material from discrete areas on a wafer during processing comprising:
- suspending a liquid etchant material proximate a tip portion of an etchant applicator;
moving the etchant applicator and suspended liquid sufficiently close to a discrete area on a wafer to transfer at least some suspended liquid etchant material onto the discrete area; and
retaining the liquid etchant material within the discrete area without using a physical barrier as part of the etchant applicator.
2 Assignments
0 Petitions
Accused Products
Abstract
Methods and apparatuses for removing material from discrete areas on a semiconductor wafer are described. In one implementation, an etchant applicator is provided having a tip portion. Liquid etchant material is suspended proximate the tip portion and the etchant applicator is moved, together with the suspended liquid, sufficiently close to a discrete area on a wafer to transfer liquid etchant onto the discrete area. In various embodiments the tip portion can comprise fluid permeable materials, fluid-absorbent materials, and/or wick assemblies. An exhaust outlet can be provided operably proximate the tip portion for removing material from over the wafer. The tip portion can be moved to touch the discrete area.
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Citations
50 Claims
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1. A method of removing material from discrete areas on a wafer during processing comprising:
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suspending a liquid etchant material proximate a tip portion of an etchant applicator; moving the etchant applicator and suspended liquid sufficiently close to a discrete area on a wafer to transfer at least some suspended liquid etchant material onto the discrete area; and retaining the liquid etchant material within the discrete area without using a physical barrier as part of the etchant applicator. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of removing material from discrete areas on a wafer during processing comprising:
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providing an etchant applicator having a tip portion; providing an amount of etchant material over the tip portion, the etchant material being supported by the tip portion; placing the tip portion into proximity with a discrete area of a wafer sufficiently to bring at least some of the supported etchant material into physical contact with the discrete area; removing the tip portion from the wafer, at least some of the supported etchant material being left behind thereon; and retaining any liquid portion of the etchant material within the discrete area without using a physical barrier as part of the etchant applicator. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method of removing material from discrete areas on a wafer during processing comprising:
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clinging a liquid etchant material onto an applicator tip portion; moving the applicator tip portion and clung liquid etchant to sufficiently proximate a discrete area on a wafer to cause removal of clung liquid etchant material from the tip portion and onto the discrete area; and retaining the liquid etchant material within the discrete area without using a physical barrier as part of the applicator tip portion. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A method of removing material from discrete areas on a wafer during processing comprising:
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providing a liquid etchant applicator having a fluid-permeable tip portion; providing liquid etchant material over the fluid-permeable tip portion; moving the fluid-permeable tip portion into contact with a discrete area of a wafer; removing the fluid-permeable tip portion from the wafer, at least some of the liquid etchant material being left behind thereon; and retaining the liquid etchant material within the discrete area without using a physical barrier as part of the etchant applicator. - View Dependent Claims (21, 22, 23, 24)
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25. A method of removing material from discrete areas on a wafer during processing comprising:
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providing a liquid etchant applicator having a wick assembly thereon configured for receiving an amount of liquid etchant; supporting an amount of liquid etchant with said wick assembly; transferring at least some of the liquid etchant from said wick assembly onto a discrete area on a wafer; and retaining the liquid etchant within the discrete area without using a physical barrier as part of the etchant applicator. - View Dependent Claims (26, 27, 28, 29, 30)
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31. A method of removing material from discrete areas on a wafer during processing comprising:
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providing a liquid etchant applicator assembly comprising a fluid-permeable tip portion and an exhaust outlet proximate the tip portion, the exhaust outlet being configured to remove material from around the tip portion; providing the fluid-permeable tip portion with liquid etchant material; moving the fluid-permeable tip portion into contact with a discrete area of a wafer; transferring at least some of the liquid etchant material from the fluid-permeable tip portion onto the wafer;
retaining the liquid etchant material within the discrete area without reliance on any part of the etchant applicator as a physical barrier; andremoving material from over the discrete area through the exhaust outlet. - View Dependent Claims (32, 33, 34, 35)
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36. A method of removing material from discrete areas on a wafer during processing comprising:
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providing a liquid etchant applicator comprising a fluid-absorbent tip portion; providing a liquid etchant reservoir in fluid communication with the fluid-absorbent tip portion; absorbing liquid etchant from the reservoir onto the fluid-absorbent tip portion; contacting a discrete area on a wafer with the fluid-absorbent tip portion, the contacting transferring some of the liquid etchant onto the discrete area; and retaining the liquid etchant within the discrete area without using a physical barrier as part of the etchant applicator. - View Dependent Claims (37, 38)
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39. A method of removing material from discrete areas on a wafer during processing comprising:
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providing a liquid etchant applicator having a fluid-permeable tip portion; dipping at least some of the tip portion into an amount of liquid etchant material; transferring at least some liquid etchant from the dipped tip portion onto a discrete area on a wafer; and retaining the liquid etchant material within the discrete area without using a physical barrier as part of the etchant applicator. - View Dependent Claims (40, 41)
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42. A method of removing material from over alignment marks on a wafer during processing comprising:
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providing a substrate having a plurality of alignment marks thereover; processing the substrate and depositing material over the alignment marks; providing a liquid etchant applicator having a fluid-permeable tip portion; providing liquid etchant material over the fluid-permeable tip portion; moving the liquid etchant applicator into proximity with the alignment marks; transferring at least some of the liquid etchant material from the fluid-permeable tip portion onto the material over the alignment marks; and retaining the liquid etchant material where transferred without using a physical barrier as part of the etchant applicator. - View Dependent Claims (43, 44, 45, 46)
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47. A method of removing material from discrete areas on a wafer during processing comprising:
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providing a liquid etchant applicator having a fluid-permeable tip portion; providing liquid etchant material over the fluid-permeable tip portion;
dabbing a discrete area on a wafer with the tip portion sufficiently to transfer liquid etchant material onto the discrete area; andretaining the liquid etchant material within the discrete area without using a physical barrier as part of the etchant applicator. - View Dependent Claims (48, 49)
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50. A method of removing material from discrete areas on a wafer during processing comprising:
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providing a liquid etchant applicator having a fluid-permeable tip portion; providing liquid etchant material over the fluid-permeable tip portion; touching a discrete area on a wafer with the tip portion sufficiently to transfer liquid etchant material onto the discrete area; while the tip portion is touching the wafer, moving the tip portion across a surface of the wafer; and retaining the liquid etchant material within the discrete area without using a physical barrier as part of the etchant applicator.
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Specification