Electronic assembly for removing heat from a semiconductor device

• US 6,154,369 A
• Filed: 12/07/1999
• Issued: 11/28/2000
• Est. Priority Date: 03/23/1998
• Status: Expired due to Term

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Kalfus, Martin Aaron, Martinez, Jr., Joe Luis, Rodriguez, Pablo
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US09/456,489
• Time in Patent Office: 357 Days
• Field of Search: 252/706, 252/713, 252/717, 174/252, 165/80.3, 165/185, 361/704, 361/705, 361/707, 361/703, 361/709-713, 361/717-719
• US Class Current: 361/719
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

An electronic assembly (20) having an insulated metal heat sink (10) and a method of manufacturing the electronic assembly (20). The electronic assembly (20) has a heat dissipater (11), a dielectric material (12), and a conductive layer (13). A semiconductor chip (21) is attached to the insulated metal heat sink (10). Heat generated by the semiconductor chip (21) is conducted to the conduction surface (14) of the heat dissipater (11). In one embodiment a convection surface (16) of the heat dissipater (11) is present and the heat is transferred from the convection surface (16) of the heat dissipater (11) to a fluid by convection. The fluid is directed by a manifold (64).

Claims

1. An electronic assembly comprising:

an insulated metal heat sink comprising

a heat dissipater having a conduction surface and a convection surface, the convection surface having a plurality of fins to increase surface area of the convection surface;

a dielectric material disposed over the heat dissipater;

a heat generating component disposed on the dielectric material;

a substrate coupled to the dielectric material;

an electrically conductive layer connecting the heat dissipater and the substrate;

a fluid manifold located on the heat dissipater; and

a housing having an electrical interconnect coupled to the substrate to contain the electronic assembly.

2. The electronic assembly of claim 1, further including a module cover on to the housing.

3. The electronic assembly of claim 1, wherein the fluid manifold has a plurality of ports.

4. The electronic assembly of claim 1, wherein a material for the fluid manifold is selected from the group consisting of plastic, metal, and ceramic.

5. The electronic assembly of claim 1, wherein the fluid manifold includes at least one fastener.

6. The electronic assembly of claim 1, further including an O-ring between the fluid manifold and the heat dissipater.

7. The electronic assembly of claim 1, further including a potting compound, wherein the potting compound is within the housing.

8. The electronic assembly of claim 1, wherein the heat generating component is a semiconductor chip.

9. The electronic assembly of claim 1 wherein the substrate is selected from the group consisting of a printed circuit board, a circuitized ceramic packaging substrate, a circuitized metal packaging substrate, a circuitized glass packaging substrate, a circuitized semiconductor substrate and combinations thereof.