Plasma processing apparatus

• US 6,156,151 A
• Filed: 07/17/1997
• Issued: 12/05/2000
• Est. Priority Date: 07/19/1996
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Yatsuda, Koichi, Komino, Mitsuaki, Arami, Junichi
• Primary Examiner(s): Pyon, Harold
• Assistant Examiner(s): PACHECO, LIZA M
• Application Number:
  US08/895,993
• Time in Patent Office: 1,237 Days
• Field of Search: 118/723 VE, 118/723 R, 118/719, 118/715, 156/345 P, 156/345
• US Class Current: 156/345.29
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32458 Vessel
• CPC Class Codes: H01J 37/32834 Exhausting

Abstract

A plasma etching apparatus has a central processing chamber, an upper exhaust chamber thereabove, and a lower exhaust chamber therebelow. The processing chamber, the upper exhaust chamber, and the lower exhaust chamber are airtightly formed by a central casing part, an upper casing part, and a lower casing part which are separably combined. The upper and lower exhaust chambers are respectively connected to upper and lower exhaust pumps. A susceptor having a support surface for supporting a target object, and an upper electrode or shower head opposing it are arranged in the processing chamber. A processing gas spouted through the shower head flows upward and downward toward the upper and lower exhaust chambers via the processing chamber.

Claims

1. An apparatus for processing a target object using a plasma, comprising:

an airtight processing chamber;

a work table having a support surface for supporting said target object in said processing chamber;

upper and lower exhaust systems for jointly evacuating an interior of said processing chamber and jointly exhausting a gas on said target object, said upper and lower exhaust systems flowing gas in said processing chamber upward and downward, respectively;

a gas supply system for supplying a processing gas to said processing chamber; and

an electric field generator for generating, in said processing chamber, an electric field for converting said processing gas into a plasma through discharge.

2. An apparatus according to claim 1, wherein said upper exhaust system has an upper exhaust chamber arranged above said processing chamber, and a plurality of upper exhaust holes formed in an upper partition plate between said processing chamber and said upper exhaust chamber.

3. An apparatus according to claim 2, wherein said gas supply system has a supply port which opens above said work table, and said upper exhaust holes are arranged to surround said supply port.

4. An apparatus according to claim 3, wherein said gas supply system comprises a shower head arranged above said work table, and said shower head has a diffusion plate in which a plurality of supply holes functioning as said supply port are formed.

5. An apparatus according to claim 4, wherein said partition plate and said upper diffusion plate form one ceiling plate for defining a ceiling of said processing chamber.

6. An apparatus according to claim 5, wherein said processing chamber, except for said support surface of said work table, is defined by a central casing part having an integrally continuous inner wall surface exposed in said processing chamber, and a potential on said inner wall surface is set substantially uniform.

7. An apparatus according to claim 6, wherein said upper exhaust chamber and said shower head are airtightly formed by said central casing part, and an upper casing part which is separably combined with said central casing part.

8. An apparatus according to claim 3, wherein said lower exhaust system has a lower exhaust chamber arranged below said processing chamber, said lower exhaust chamber has a gate for loading/unloading said target object therein/therefrom, and said work table can vertically move to move said support surface between a lower position in said lower exhaust chamber and an upper position in said processing chamber.

9. An apparatus according to claim 8, wherein said lower exhaust system has a plurality of lower exhaust holes formed in a lower partition plate between said processing chamber and said lower exhaust chamber.

10. An apparatus according to claim 9, wherein said processing chamber, except for said support surface of said work table, is defined by a central casing part having an integrally continuous inner wall surface exposed in said processing chamber, and a potential on said inner wall surface is set substantially uniform.

11. An apparatus according to claim 10, wherein said lower exhaust chamber is airtightly formed by said central casing part, and a lower casing part which surrounds said work table and is separably combined with said central casing part.

12. An apparatus according to claim 1, further comprising a controller for interlocking said upper and lower exhaust systems.

13. An apparatus according to claim 12, wherein said controller controls said upper and lower exhaust systems to keep a difference in exhaust amounts between said upper and lower exhaust systems constant in performing a process.

14. An apparatus according to claim 13, wherein said upper and lower exhaust systems respectively have upper and lower pressure regulating valves, and said controller controls said upper and lower exhaust systems to keep a difference in opening degrees between said upper and lower pressure regulating valves constant in performing a process.

15. An apparatus for processing a target object using a plasma, comprising:

an airtight processing chamber;

a work table having a support surface for supporting said target object in said processing chamber;

an exhaust system for evacuating an interior of said processing chamber and exhausting a gas on said target object;

a gas supply system for supplying a processing gas to said processing chamber; and

an electric field generator for generating, in said processing chamber, an electric field for converting said processing gas into a plasma through discharge,

wherein said processing chamber, except for said support surface of said work table, is defined by a central casing part having an integrally molded continuous conductive inner wall surface exposed in said processing chamber, said inner wall surface has a ceiling surface and a floor surface corresponding to a ceiling and a floor of said processing chamber, and a potential on said inner wall surface is set substantially uniform, and

wherein said ceiling surface has first holes used as part of said gas supply system for supplying said processing gas, and said floor surface has second holes used as part of said exhaust system for evacuating the interior of said processing chamber.

16. An apparatus according to claim 15, wherein said inner wall surface is formed substantially smooth.

17. An apparatus according to claim 15, wherein said exhaust system comprises an upper exhaust system, wherein said upper and lower exhaust systems flow gas in said processing chamber upward and downward, respectively.

18. An apparatus according to claim 17, wherein said upper exhaust system has an upper exhaust chamber arranged above said processing chamber, said gas supply system has a shower head arranged above said work table, and said upper exhaust chamber and said shower head are airtightly formed by said central casing part, and an upper casing part which is separably combined with said central casing part.

19. An apparatus according to claim 15, wherein said exhaust system comprises a lower exhaust system including a lower exhaust chamber arranged below said processing chamber, said lower exhaust chamber has a gate for loading/unloading said target object therein/therefrom, and said work table can vertically move to move said support surface between a lower position in said lower exhaust chamber and an upper position in said processing chamber.

20. An apparatus according to claim 19, wherein said lower exhaust chamber is airtightly formed by said central casing part, and a lower casing part which surrounds said work table and is separably combined with said central casing part.