Glass circuit substrate and fabrication method thereof
First Claim
Patent Images
1. A glass circuit substrate comprising:
- (a) a layer of palladium (Pd) nuclei on a glass substrate;
(b) a plating layer of palladium--phosphorous (Pd--P) on the layer of palladium nuclei, wherein a thickness of said Pd--P plating layer is from 0.015 μ
m to 0.500 μ
m.
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Abstract
A glass circuit substrate wherein nuclei of Pd (palladium) are placed on a glass substrate and a plating layer of Pd--P (palladium--phosphorus) is placed on the nuclei. A fabrication method of the glass circuit substrate comprises steps of forming nuclei of Pd on a glass substrate; and therefore forming a plating layer of Pd--P on the nuclei.
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Citations
45 Claims
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1. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass substrate; (b) a plating layer of palladium--phosphorous (Pd--P) on the layer of palladium nuclei, wherein a thickness of said Pd--P plating layer is from 0.015 μ
m to 0.500 μ
m.
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2. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass substrate; (b) a plating layer of palladium-phosphorous (Pd--P) on the layer of palladium nuclei, wherein a content of phosphorus of said Pd--P plating layer is from 3.0 (wt %) to 10.0 (wt %).
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3. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass substrate; (b) a plating layer of palladium-phosphorous (Pd--P) on the layer of palladium nuclei, wherein a second plating layer comprised of at least one material selected from the group consisting of Cu, Ni, Ni-P, Ag, Pd, Pd--P, Au and Pt is disposed on said Pd--P plating layer.
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4. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass substrate; (b) a plating layer of palladium-phosphorous (Pd--P) on the layer of palladium nuclei, further comprising a Cu plating layer, an Ni plating layer, and an Au plating layer on said Pd--P plating layer.
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5. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass subsrate; (b) a plating layer of palladium-phosphorous (Pd--P) on the layer of palladium nuclei, further comprising an Ag plating layer and an Au plating layer on said Pd--P plating layer.
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6. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass substrate; (b) a plating layer of palladium-phosphorous (Pd--P) on the layer of palladium nuclei, said Pd--P plating layer having a thickness of from 0.015 μ
m to 0.500 μ
m and a phosphorous content of from 3.0 (wt%) to 10.0 (wt%); and(c) a second plating layer comprised of at least one material selected from the group consisting of Cu, Ni, Ni-P, Ag, Pd, Pd--P, Au, and Pt disposed on said Pd--P plating layer.
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7. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass substrate; (b) a plating layer of palladium-phosphorous (Pd--P) on the layer of palladium nuclei; and (c) another Pd--P plating layer on said Pd--P plating layer, wherein said Pd--P plating layer on the layer of palladium nuclei is in an amorphous state and said another Pd--P plating layer is in a crystalline state. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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8. A glass circuit substrate comprising:
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(a) a layer of palladium (Pd) nuclei on a glass substrate; (b) a plating layer of palladium-phosphorous (Pd--P) on the layer of palladium nuclei, wherein (c) said glass substrate is a non-roughed glass substrate and said Pd--P plating layer is an electroless plating layer; and (d) a metal plating film is placed on said Pd--P plating layer. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for fabricating a glass circuit substrate comprising steps of:
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forming nuclei of Pd (palladium) on a glass substrate; and thereafter forming a plating layer of Pd--P (palladium-phosphorus) on said nuclei, said Pd--P plating layer having a thickness of from 0.015 μ
m to 0.500 μ
m.
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28. A method for fabricating a glass circuit substrate comprising steps of:
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forming nuclei of Pd (palladium) on a glass substrate; and thereafter forming a plating layer of Pd--P (palladium-phosphorous) on said nuclei, said Pd--P plating layer having a phosphorous content of from 3.0 (wt %) to 10.0 (wt %).
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29. A method for fabricating a glass circuit substrate comprising steps of:
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forming nuclei of Pd (palladium) on a glass substrate; and forming a first plating layer of Pd--P (palladium-phosphorous) on said nuclei; and forming a second plating layer on said first plating layer; wherein said second plating layer is comprised of a metal or an alloy of two or more selected from the group consisting of Cu, Ni, Ni--P, Ag, Pd, Pd--P, Au, and Pt.
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30. A method for fabricating a glass circuit substrate comprising steps of:
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forming nuclei of Pd (palladium) on a glass substrate; and thereafter forming a plating layer of Pd--P (palladium-phosphorus) on said nuclei, said Pd--P plating layer having a thickness of from 0.015 μ
m to 0.500 μ
m and a phosphorous content of from 3.0 (wt%) to 10.0 (wt %). - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40)
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31. A method for fabricating a glass circuit substrate comprising steps of:
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forming nuclei of Pd (palladium) on a glass substrate; thereafter forming a plating layer of Pd--P (palladium-phosphorus) on said nuclei; and providing a Cu plating layer, a Ni plating layer, a Au plating layer, a Ag and a Au plating layer, and another Pt plating layer on said Pd--P plating layer.
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32. A method for fabricating a glass circuit substrate comprising steps of:
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forming nuclei of Pd (palladium) on a glass substrate, wherein said glass substrate is a non-roughed glass substrate; thereafter forming a plating layer of Pd--P (palladium-phosphorus) on said nuclei wherein said Pd--P plating layer is an electroless plating layer; and placing a metal plating film on said Pd--P plating layer. - View Dependent Claims (41, 42, 43, 44, 45)
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Specification