Chip package with transfer mold underfill

• US 6,157,086 A
• Filed: 11/18/1999
• Issued: 12/05/2000
• Est. Priority Date: 10/29/1997
• Status: Expired due to Fees

• Current Assignee: Interconnect Systems, Inc. (KOCH Industries Incorporated)
• Original Assignee: Patrick O. Weber
• Inventors: Weber, Patrick O.
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US09/442,390
• Time in Patent Office: 383 Days
• Field of Search: 257/788, 257/789, 257/795
• US Class Current: 257/788
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/83136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/28 Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: Y10S 425/812 Venting
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

An integrated circuit chip package according to the present invention includes an integrated circuit chip mounted on a substrate by a plurality of solder bumps. A mold compound is used for underfilling air gaps between the chip and the substrate. The integrated circuit chip package is formed by placing the chip and substrate within a mold cavity and pressing a transfer mold compound into the mold cavity. Air spaces between the integrated circuit chip and the substrate are underfilled by the mold compound as it is pressed in between the integrated circuit chip and the substrate. Air is allowed to escape from between the chip and the substrate during the underfilling through a vent which extends through the substrate. The underfilling material may also be used to encapsulate the chip at the same time that underfilling is performed.

Claims

1. An integrated circuit chip package comprising:

an integrated circuit chip having an active surface with interconnection pads disposed thereon;

a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a vent hole, having a largest dimension of 0.020 inches, extending from the first side to the second side of the substrate and positioned beneath the integrated circuit chip when the chip is mounted on the substrate; and

a transfer molding composition containing between about 70 and 90 percent filler material which is forced by pressure into an air gap between the integrated circuit chip and the substrate, wherein the transfer molding composition is a material which is solid at room temperature before curing, and the transfer molding composition extending into the vent hole in the substrate.

2. The integrated circuit chip package of claim 1, wherein the transfer molding composition provides an underfilling for the integrated circuit chip.

3. The integrated circuit chip package of claim 1, wherein as the transfer molding composition is forced into the air gap between the integrated circuit chip and the substrate, the vent hole provides means for air to escape from between the integrated circuit chip and the substrate.

4. The integrated circuit chip package of claim 1, wherein the transfer molding composition is forced into the air gap between the integrated circuit chip and the substrate, and the vent hole providing means for underfilling of all spaces between said integrated circuit chip and said substrate.

6. The integrated circuit chip package of claim 1, wherein the transfer molding composition substantially encapsulates the integrated circuit chip.

7. The integrated circuit chip package of claim 1, further comprising:

a plurality of solder bumps for providing an electrical connection between the interconnection pads of the integrated circuit chip and the bonding pads on the first side of the substrate.

8. The integrated circuit chip package of claim 7, wherein the transfer molding composition substantially surrounds each of the solder bumps between the integrated circuit chip and the substrate.

5. An integrated circuit chip package comprising:

an integrated circuit chip having an active surface with interconnection pads disposed thereon;

a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a plurality of vent holes, each extending from the first side to the second side of the substrate, the vent holes having a largest dimension of 0.020 inches and positioned beneath the integrated circuit chip when the chip is mounted on the substrate; and

a transfer molding composition containing between about 70 and 90 percent filler material which is forced by pressure into an air gap between the integrated circuit chip and the substrate, and the transfer molding composition extending into the vent hole in the substrate.

9. An integrated circuit chip package comprising:

an integrated circuit chip having an active surface with interconnection pads disposed thereon;

a substrate having a first side with bonding pads substantially corresponding to the interconnection pads of the integrated circuit chip, a second side, and a vent hole which extends from the first side to the second side of the substrate and is positioned beneath the integrated circuit chip when said chip is mounted on the substrate; and

a transfer molding composition which is forced into an air gap between the integrated circuit chip and the substrate, wherein the transfer molding composition is a material which is solid at room temperature before curing, and the transfer molding composition extending into the vent hole in the substrate.

10. The integrated circuit chip of claim 9, wherein the vent hole has a largest dimension of 0.020 inches.