Process for selective transfer of a microstructure formed on an initial substrate to a final substrate
First Claim
1. Process for the selective transfer of at least one microstructure (12) formed on a substrate (10) called the initial substrate, to another substrate (32) called the final substrate, the process comprises the following steps in sequence:
- a) preparing the initial substrate to enable reversible bonding, with an initial bond force, between the initial substrate (10) and a substrate (24) called the intermediate substrate,(b) bonding of the initial substrate (10) with the intermediate substrate (24), the microstructure facing the intermediate substrate,(c) forming a layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructure, and/or on a reception region (16'"'"') of the final substrate, the bond material having a bond capacity that may be locally increased by appropriate treatment,(d) contacting the said selected region (16) of the initial substrate with the reception region on the final substrate,(e) treating the layer of bond material in an area corresponding to the selected region (16) of the initial substrate, comprising the microstructure, to locally increase the bond force in this area to a value exceeding the initial bond force, to fix the said selected region (16) of the initial substrate onto the reception region (16'"'"') on the final substrate (32),(f) breaking the bond between the selected region (16) of the initial substrate, including the microstructure, and the intermediate substrate (24), wherein portions of the initial substrate remain bonded to the intermediate substrate.
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Accused Products
Abstract
Process for transfer of a microstructure (12) from an initial substrate (10) to a final substrate (32). The process includes the following steps in sequence:
bonding between the initial substrate (10) and an intermediate substrate (24), the microstructure facing the intermediate substrate,
formation of at least one layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructure
bring the said selected region (16) into contact with the final substrate,
treatment of the bond material in an area corresponding to the selected region (16), to increase the bond force,
breaking the selected region (16) of the initial substrate, from the intermediate substrate (24).
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Citations
19 Claims
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1. Process for the selective transfer of at least one microstructure (12) formed on a substrate (10) called the initial substrate, to another substrate (32) called the final substrate, the process comprises the following steps in sequence:
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a) preparing the initial substrate to enable reversible bonding, with an initial bond force, between the initial substrate (10) and a substrate (24) called the intermediate substrate, (b) bonding of the initial substrate (10) with the intermediate substrate (24), the microstructure facing the intermediate substrate, (c) forming a layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructure, and/or on a reception region (16'"'"') of the final substrate, the bond material having a bond capacity that may be locally increased by appropriate treatment, (d) contacting the said selected region (16) of the initial substrate with the reception region on the final substrate, (e) treating the layer of bond material in an area corresponding to the selected region (16) of the initial substrate, comprising the microstructure, to locally increase the bond force in this area to a value exceeding the initial bond force, to fix the said selected region (16) of the initial substrate onto the reception region (16'"'"') on the final substrate (32), (f) breaking the bond between the selected region (16) of the initial substrate, including the microstructure, and the intermediate substrate (24), wherein portions of the initial substrate remain bonded to the intermediate substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification