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Apparatus and method for applying heat bondable lamina to a substrate

  • US 6,159,327 A
  • Filed: 05/08/1998
  • Issued: 12/12/2000
  • Est. Priority Date: 04/12/1996
  • Status: Expired due to Term
First Claim
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1. An apparatus for automatically laminating two sides of a generally planar substrate, said apparatus comprising:

  • a lamina supply route,a lamina supply member, said member capable of holding a webless supply of lamina material which can be cut into successive sheets of laminate;

    a lamina conveyor disposed along said lamina supply route for transporting said laminate sheets;

    a substrate path having an entry and an exit, a substrate conveyor being disposed along said substrate path, said substrate conveyor capable of transporting the substrate from said entry to said exit;

    a convergence zone, said lamina supply route connecting to said substrate path in said convergence zone, a first side of the substrate being brought into registration with a first sheet of laminate in said convergence zone, a second side of the substrate being brought into registration with a second sheet of laminate in said convergence zone;

    said substrate path including a bonding station, the first cut sheet of laminate being bonded to the first side of the substrate and the second cut sheet of laminate being bonded to the second side of the substrate in said bonding station, said substrate path including said convergence zone following said entry, said bonding station following said convergence zone and said exit followingsaid bonding station, whereby the first and second sides of the substrate can both be laminated during a single pass of the substrate along the substrate path; and

    a lamina sensor disposed along said lamina supply route and in communication with said lamina conveyor, said lamina sensor capable of detecting a predetermined reference of the lamina and signaling said lamina conveyor in response to said detection.

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