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Plasma etching method and plasma etching system for carrying out the same

  • US 6,159,388 A
  • Filed: 01/26/1998
  • Issued: 12/12/2000
  • Est. Priority Date: 02/18/1997
  • Status: Expired due to Fees
First Claim
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1. A plasma etching method of removing a relatively thick portion from a surface of an article of concern to realize flatness thereof through an etching process by ejecting a gas of activated species onto to said relatively thick portion from a jet nozzle of a plasma generating means disposed substantially in opposition to said relatively thick portion,said method comprising:

  • measuring an actual etched quantity of said relatively thick portion by using a laser light beam; and

    terminating the etching process for said relatively thick portion when said actual etch quantity has attained a desired value.

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