Method and apparatus for applying atomized adhesive to a leadframe for chip bonding

• US 6,159,609 A
• Filed: 09/02/1999
• Issued: 12/12/2000
• Est. Priority Date: 03/11/1996
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Evers, Sven
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/388,681
• Time in Patent Office: 467 Days
• Field of Search: 428/458, 428/333, 428/338, 428/339, 257/709, 257/724, 257/725, 174/259
• US Class Current: 428/458
• CPC Class Codes: B05B 7/0075 Nozzle arrangements in gas streams
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/83805 involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01026 Iron [Fe]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/0132 Binary Alloys
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/15747 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y10T 428/261 : In terms of molecular thickness or light wave length
• CPC Class Codes: Y10T 428/268 : Monolayer with structurally defined element
• CPC Class Codes: Y10T 428/269 : including synthetic resin or polymer layer or component
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe are disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum that encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed for further prevention of adhesive application to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated, as well as leadframes.

Claims

1. A semiconductor device assembly comprising:

a semiconductor device component of said semiconductor device assembly bearing an atomized adhesive on at least one surface thereof; and

another semiconductor device component of said semiconductor device assembly adhered to said semiconductor device component by said atomized adhesive.

2. The semiconductor device assembly of claim 1, wherein said atomized adhesive comprises a layer of substantially uniform thickness.

3. The semiconductor device assembly of claim 1, wherein said atomized adhesive comprises a substantially confluent layer.

4. The semiconductor device assembly of claim 1, wherein said atomized adhesive comprises adhesive particles of about 50 μ

m to about 100 μ

m size.

5. The semiconductor device assembly of claim 1, wherein said atomized adhesive resides on a single surface of said semiconductor device component.

6. A semiconductor device assembly comprising:

a semiconductor device component of said semiconductor device assembly; and

an a tomized adhesive comprising adhesive particles of about 50 μ

m to about 100 μ

m size disposed on at least one surface of said semiconductor device component.

7. The semiconductor device assembly of claim 6, further comprising another semiconductor device component of said semiconductor device assembly adhered to said semiconductor device component by said atomized adhesive.

8. The semiconductor device assembly of claim 6, wherein said atomized adhesive comprises a layer of substantially uniform thickness.

9. The semiconductor device assembly of claim 6, wherein said atomized adhesive comprises a substantially confluent layer.

10. The semiconductor device assembly of claim 6, wherein said at least one surface comprises a single surface of said semiconductor device component.

11. A semiconductor device assembly comprising:

a semiconductor device component of said semiconductor device assembly; and

an atomized adhesive confluently disposed on at least one surface of said semiconductor device component.

12. The semiconductor device assembly of claim 11, wherein said atomized adhesive comprises adhesive particles of about 50 μ

m to about 100 μ

m size.

13. The semiconductor device assembly of claim 11, further comprising another semiconductor device component of said semiconductor device assembly adhered to said semiconductor device component by said atomized adhesive.

14. The semiconductor device assembly of claim 11, wherein said atomized adhesive comprises a layer of substantially uniform thickness.

15. A semiconductor device assembly comprising:

a first semiconductor device component of said semiconductor device assembly bearing an atomized adhesive on one surface thereof; and

a second semiconductor device component of said semiconductor assembly adhered to said first semiconductor device component by said atomized adhesive on one surface of said first semiconductor device component.

16. The semiconductor device assembly of claim 15, wherein said atomized adhesive comprises a layer of substantially uniform thickness.

17. The semiconductor device assembly of claim 15, wherein said atomized adhesive comprises a substantially confluent layer.

18. The semiconductor device assembly of claim 15, wherein said atomized adhesive comprises adhesive particles of about 50 μ

m to about 100 μ

m size.

19. A semiconductor device assembly comprising:

a semiconductor device component of said semiconductor device assembly; and

an atomized adhesive comprising adhesive particles of about 50 μ

m to about 100 μ

m size disposed on one surface of said semiconductor device component of said semiconductor device assembly.

20. The semiconductor device assembly of claim 19, further comprising another semiconductor device component adhered to said semiconductor device component by said atomized adhesive.

21. The semiconductor device assembly of claim 19, wherein said atomized adhesive comprises a layer of substantially uniform thickness.

22. The semiconductor device assembly of claim 19, wherein said atomized adhesive comprises a substantially confluent layer.

23. A semiconductor device assembly comprising:

a plurality of semiconductor device components of said semiconductor device assembly; and

an atomized adhesive confluently disposed on at least one surface of each semiconductor device component of said plurality of semiconductor device components.

24. The semiconductor device assembly of claim 23, wherein said atomized adhesive comprises adhesive particles of about 50 μ

m to about 100 μ

m size.

25. The semiconductor device assembly of claim 23, further comprising another plurality of semiconductor device components of said semiconductor device assembly adhered to said plurality of semiconductor device components by said atomized adhesive.

26. The semiconductor device assembly of claim 23, wherein said atomized adhesive comprises a layer of substantially uniform thickness.