Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method

• US 6,160,042 A
• Filed: 10/01/1998
• Issued: 12/12/2000
• Est. Priority Date: 05/01/1997
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: Edison Polymer Innovation Corporation
• Inventors: Ishida, Hatsuo
• Primary Examiner(s): YOON, TAE H
• Application Number:
  US09/164,927
• Time in Patent Office: 803 Days
• Field of Search: 523/208, 523/415, 523/445, 428/703, 423/290, 524/404
• US Class Current: 523/445
• CPC Class Codes: C08K 9/04 Ingredients treated with organic substances treated with macromolecular compounds C08K9/08

Abstract

A low viscosity high thermal conductivity polymer-based boron nitride composition and a surface-treated boron nitride material for use as a filler in this composition, and methods of preparation is described.

Claims

1. A method for forming a low viscosity high thermal conductivity polymer composite containing particles of hexagonal boron nitride comprising the steps of:

(a) treating the surface of the hexagonal boron nitride particles with 1,4-phenylene diisocyanate, (b) thereafter reacting the thus-treated boron nitride particles with a compound of the formula

space="preserve" listing-type="equation">H.sub.2 N--X--Y

where

X is a linear or branched aliphatic group having from 1 to 40 carbon atoms, or a substituted or unsubstituted phenylene group wherein the substituents are methyl, ethyl, propyl, hydroxyl, nitro, methoxy, ethoxy, phenyl, or another Y group or one or more F or CF₃ groups,

Y is hydroxyl, amino, methyleneamino, ethyleneamino, amido, thiol, epoxy, vinyl, acetylenyl, silanol, nitrile, carboxyl, methacryl, acryl, allyl, anhydride, cyanate, norbornenyl, or maleimido and, where applicable, may have additional substituents selected from the group consisting of --CF₃, --CF₂ CF₃, and, --CF₂ CF₂ CF₃, and (c) combining the surface treated hexagonal boron nitride particles with a compound selected from the group consisting of benzoxazine, epoxy resins and novolac or resol phenolic resins and reacting the compound filled with treated boron nitride to form said low viscosity high thermal conductivity polymer composite.

2. A method according to claim 1 wherein, in the compound of the formula H₂ N--X--Y, X is phenylene and Y is ortho-, meta- or para-OH.

3. A method as defined in claim 1 where the treatment in steps (a) and (b) occurs using tetrahydrofuran (THF) as solvent.

5. A surface treated boron nitride as defined in claim 1 coupled to a polymer selected from the group consisting of polybenzoxazine, epoxy resins and novolac or resol phenolic resins.

4. A surface treated boron nitride material of the formula:

##STR6##

6. A composition for use in forming a low viscosity high thermal conductivity polymer based composite comprising a polymer selected from the group consisting of polybenzoxazine, epoxy resins and novolac or resol phenolic resins and a filler material including particles of surface treated boron nitride with the surface treated boron nitride having the following surface treatment schematic representation:

where

X is a linear or branched aliphatic group having from 1 to 40 carbon atoms, or a substituted or unsubstituted phenylene group wherein the substituents are methyl, ethyl, propyl, hydroxyl, nitro, methoxy, ethoxy, phenyl, or another Y group or one or more F or CF₃ groups,

Y is hydroxyl, amino, methyleneamino, ethyleneamino, amido, thiol, epoxy, vinyl, acetylenyl, silanol, nitrile, carboxyl, methacryl, acryl, allyl, anhydride, cyanate, norbornenyl, or maleimido, and, where applicable, may have additional substituents selected from the group consisting of --CF₃, --CF₂ CF₃, and, --CF₂ CF₂ CF₃.

7. A composition as defined in claim 6 wherein X is phenylene and Y is ortho-, meta- or para-OH.

8. A composition according to claim 7 wherein X is phenylene and Y is para-OH.