Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
First Claim
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1. A method for forming a low viscosity high thermal conductivity polymer composite containing particles of hexagonal boron nitride comprising the steps of:
- (a) treating the surface of the hexagonal boron nitride particles with 1,4-phenylene diisocyanate, (b) thereafter reacting the thus-treated boron nitride particles with a compound of the formula
space="preserve" listing-type="equation">H.sub.2 N--X--YwhereX is a linear or branched aliphatic group having from 1 to 40 carbon atoms, or a substituted or unsubstituted phenylene group wherein the substituents are methyl, ethyl, propyl, hydroxyl, nitro, methoxy, ethoxy, phenyl, or another Y group or one or more F or CF3 groups,Y is hydroxyl, amino, methyleneamino, ethyleneamino, amido, thiol, epoxy, vinyl, acetylenyl, silanol, nitrile, carboxyl, methacryl, acryl, allyl, anhydride, cyanate, norbornenyl, or maleimido and, where applicable, may have additional substituents selected from the group consisting of --CF3, --CF2 CF3, and, --CF2 CF2 CF3, and (c) combining the surface treated hexagonal boron nitride particles with a compound selected from the group consisting of benzoxazine, epoxy resins and novolac or resol phenolic resins and reacting the compound filled with treated boron nitride to form said low viscosity high thermal conductivity polymer composite.
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Abstract
A low viscosity high thermal conductivity polymer-based boron nitride composition and a surface-treated boron nitride material for use as a filler in this composition, and methods of preparation is described.
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Citations
8 Claims
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1. A method for forming a low viscosity high thermal conductivity polymer composite containing particles of hexagonal boron nitride comprising the steps of:
- (a) treating the surface of the hexagonal boron nitride particles with 1,4-phenylene diisocyanate, (b) thereafter reacting the thus-treated boron nitride particles with a compound of the formula
space="preserve" listing-type="equation">H.sub.2 N--X--Ywhere X is a linear or branched aliphatic group having from 1 to 40 carbon atoms, or a substituted or unsubstituted phenylene group wherein the substituents are methyl, ethyl, propyl, hydroxyl, nitro, methoxy, ethoxy, phenyl, or another Y group or one or more F or CF3 groups, Y is hydroxyl, amino, methyleneamino, ethyleneamino, amido, thiol, epoxy, vinyl, acetylenyl, silanol, nitrile, carboxyl, methacryl, acryl, allyl, anhydride, cyanate, norbornenyl, or maleimido and, where applicable, may have additional substituents selected from the group consisting of --CF3, --CF2 CF3, and, --CF2 CF2 CF3, and (c) combining the surface treated hexagonal boron nitride particles with a compound selected from the group consisting of benzoxazine, epoxy resins and novolac or resol phenolic resins and reacting the compound filled with treated boron nitride to form said low viscosity high thermal conductivity polymer composite. - View Dependent Claims (2, 3, 5)
- (a) treating the surface of the hexagonal boron nitride particles with 1,4-phenylene diisocyanate, (b) thereafter reacting the thus-treated boron nitride particles with a compound of the formula
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4. A surface treated boron nitride material of the formula:
- ##STR6##
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6. A composition for use in forming a low viscosity high thermal conductivity polymer based composite comprising a polymer selected from the group consisting of polybenzoxazine, epoxy resins and novolac or resol phenolic resins and a filler material including particles of surface treated boron nitride with the surface treated boron nitride having the following surface treatment schematic representation:
- where
X is a linear or branched aliphatic group having from 1 to 40 carbon atoms, or a substituted or unsubstituted phenylene group wherein the substituents are methyl, ethyl, propyl, hydroxyl, nitro, methoxy, ethoxy, phenyl, or another Y group or one or more F or CF3 groups, Y is hydroxyl, amino, methyleneamino, ethyleneamino, amido, thiol, epoxy, vinyl, acetylenyl, silanol, nitrile, carboxyl, methacryl, acryl, allyl, anhydride, cyanate, norbornenyl, or maleimido, and, where applicable, may have additional substituents selected from the group consisting of --CF3, --CF2 CF3, and, --CF2 CF2 CF3. - View Dependent Claims (7, 8)
- where
Specification