Apparatus for testing an integrated circuit in an oven during burn-in
First Claim
1. A system for concurrent testing a plurality of integrated circuits ("ICs") under elevated temperatures comprising:
- an oven;
a burn-in board enclosed in the oven and coupled to the oven and containing the ICs;
a driver/interface board coupled to the burn-in board for transferring signals to and from the burn-in board;
a computer coupled to the driver/interface board for controlling a burn-in test of the ICs;
a switch module on the burn-in board for transferring signals to be written to the ICs that cause the ICs to perform intended functions and for transferring signals read from the ICs that indicate whether the intended functions were performed, the switch module comprising;
a plurality of signal inputs;
a plurality of high order signal outputs;
a plurality of low order signal outputs;
a first set of switches for connecting the plurality of signal inputs to the plurality of high order signal outputs;
a second set of switches for connecting the plurality of signal inputs to the plurality of low order signal outputs, wherein the first and the second set of switches are capable of operating at temperatures in excess of 150 degrees Celsius.
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Accused Products
Abstract
An apparatus for testing an integrated circuit in an oven during burn-in. A burn-in board in the oven is electrically connected to a plurality of integrated circuit ("IC") components. A driver/interface board outside the oven is electrically connected to the burn-in board through a plurality of contacts and sends and receives a plurality of signals between the IC components and a test controller. A switch module on the burn-in board comprises a plurality of high-temperature switches for transferring signals between the plurality of IC components and the driver/interface board during burn-in. A plurality of signals entering the switch module from the driver/interface board does not exceed in number the plurality of contacts, and is fewer in number than a plurality of signals exiting the switch module to the plurality of IC components.
25 Citations
2 Claims
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1. A system for concurrent testing a plurality of integrated circuits ("ICs") under elevated temperatures comprising:
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an oven; a burn-in board enclosed in the oven and coupled to the oven and containing the ICs; a driver/interface board coupled to the burn-in board for transferring signals to and from the burn-in board; a computer coupled to the driver/interface board for controlling a burn-in test of the ICs; a switch module on the burn-in board for transferring signals to be written to the ICs that cause the ICs to perform intended functions and for transferring signals read from the ICs that indicate whether the intended functions were performed, the switch module comprising; a plurality of signal inputs; a plurality of high order signal outputs; a plurality of low order signal outputs; a first set of switches for connecting the plurality of signal inputs to the plurality of high order signal outputs; a second set of switches for connecting the plurality of signal inputs to the plurality of low order signal outputs, wherein the first and the second set of switches are capable of operating at temperatures in excess of 150 degrees Celsius. - View Dependent Claims (2)
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Specification
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- Resources
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Current AssigneeOrchard Holdings, LLC
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Original AssigneePycon, Inc.
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InventorsPrakash, Kombupalayam M., Eliashberg, Victor M.
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Primary Examiner(s)Karlsen, Ernest
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Application NumberUS09/525,863Time in Patent Office274 DaysField of Search324/760, 324/158.1, 324/754, 324/763, 714/733, 714/734, 219/209US Class Current324/750.05CPC Class CodesG01R 31/2863 Contacting devices, e.g. so...G01R 31/2879 related to electrical aspec...
