Micromagnetic device for power processing applications and method of manufacture therefor

• US 6,160,721 A
• Filed: 01/24/2000
• Issued: 12/12/2000
• Est. Priority Date: 06/10/1997
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Lotfi, Ashraf W., Steigerwald, Michael L., Kossives, Dean P., Van Dover, R. Bruce, Schneemeyer, Lynn F.
• Primary Examiner(s): NGUYEN, MATTHEW VAN
• Application Number:
  US09/490,655
• Time in Patent Office: 323 Days
• Field of Search: 363/15, 363/16, 363/20, 363/21, 363/97, 363/131, 363/144, 363/147, 29/592.1, 29/602.1, 333/24.1
• US Class Current: 363/15
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.

Claims

1. A power processing circuit, comprising:

an input source of electrical power;

a switching circuit for receiving said electrical power and producing therefrom switched electrical power; and

a power micromagnetic integrated circuit, including;

a substrate having an insulator coupled thereto;

a ferromagnetic core and a winding to impart a desired magnetic property to said ferromagnetic core; and

a metallic adhesive that forms a bond between said insulator and said ferromagnetic core to secure said ferromagnetic core to said substrate.

2. The power processing circuit as recited in claim 1 further comprising a rectifier and a filter circuit coupled between said integrated circuit and an output of said power processing circuit.

3. The power processing circuit as recited in claim 1 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

zirconium; and

hafnium.

4. The power processing circuit as recited in claim 1 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

vanadium;

niobium; and

tantalum.

5. The power processing circuit as recited in claim 1 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

chromium;

molybdenum; and

tungsten.

6. The power processing circuit as recited in claim 1 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

gold;

silver;

platinum;

palladium; and

copper.

7. The power processing circuit as recited in claim 1 wherein said ferromagnetic core contains an alloy material.

8. The power processing circuit as recited in claim 1 wherein said insulator includes an organic polymer.

9. A power processing circuit, comprising:

an input source of electrical power;

a switching circuit for receiving said electrical power and producing therefrom switched electrical power; and

a power micromagnetic integrated circuit, including;

a substrate,

a first conductive winding layer formed over said substrate;

a first insulative layer formed over said first conductive winding layer;

a metallic adhesive formed over said first insulative layer; and

a ferromagnetic core formed over said metallic adhesive, said metallic adhesive forming a bond between said first insulative layer and said ferromagnetic core to secure said ferromagnetic core to said substrate.

10. The power processing circuit as recited in claim 9 further comprising a passivation layer interposed between said substrate and said first conductive winding layer.

11. The power processing circuit as recited in claim 9 wherein said power micromagnetic integrated circuit further comprises a second insulative layer formed over said ferromagnetic core.

12. The power processing circuit as recited in claim 11 wherein said power micromagnetic integrated circuit further comprises a second conductive winding layer formed over said second insulative layer.

13. The power processing circuit as recited in claim 12 wherein said power micromagnetic integrated circuit further comprises a third insulative layer formed over said second conductive winding layer.

14. The power processing circuit as recited in claim 13 wherein said power micromagnetic integrated circuit further comprises at least one terminal formed in said third insulative layer.

15. The power processing circuit as recited in claim 9 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

zirconium; and

hafnium.

16. The power processing circuit as recited in claim 9 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

vanadium;

niobium; and

tantalum.

17. The power processing circuit as recited in claim 9 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

chromium;

molybdenum; and

tungsten.

18. The power processing circuit as recited in claim 9 wherein said metallic adhesive comprises a layer that contains a material selected from the group consisting of:

gold;

silver;

platinum;

palladium; and

copper.

19. The power processing circuit as recited in claim 9 wherein said ferromagnetic core contains an alloy material.

20. The power processing circuit as recited in claim 9 wherein said first insulative layer includes an organic polymer.