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Device to encapsulate a substrate containing sensitive electronic components and a pressure sensor pack

  • US 6,161,430 A
  • Filed: 10/16/1998
  • Issued: 12/19/2000
  • Est. Priority Date: 10/16/1998
  • Status: Expired due to Term
First Claim
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1. In combination, a monitoring device to be encapsulated and a device for encapsulating the monitoring device with an encapsulation material, said monitoring device including a pressure sensor and an antenna carried on a substrate, said encapsulating device including an encapsulation body having an encapsulation chamber and a damming element carried by said encapsulation body, said monitoring device disposed in said encapsulation chamber, said damming element engaging said pressure sensor to prevent the encapsulation material from clogging the pressure sensor.

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