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Method and apparatus for laser cutting materials

  • US 6,163,010 A
  • Filed: 04/24/1998
  • Issued: 12/19/2000
  • Est. Priority Date: 10/25/1996
  • Status: Expired due to Fees
First Claim
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1. A laser based system for precision processing and machining of materials, comprising(a) a pulsed solid state laser, comprising,(i) a laser cavity defined by two end mirrors,(ii) a laser medium;

  • (iii) a cylindrical laser rod directly side-pumped by a plurality of arrays of laser diode, and(iv) at least one optical element for improving the beam quality,(b) a laser beam delivery system for expanding, collimating, and focusing the laser beam;

    (c) a workstation for holding and moving a workpiece with respect to the laser beam;

    (d) a cutting nozzle for directing a jet of a pressurized fluid to the surface of said workpiece;

    wherein the laser beam has an average power from about 2 to about 100 watts and the focused laser beam has an average brightness of more than 1012 W/m2 *sr and a peak brightness of more than 1013 W/m2 *sr.

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