×

BGA type semiconductor device and electronic equipment using the same

  • US 6,163,071 A
  • Filed: 11/27/1996
  • Issued: 12/19/2000
  • Est. Priority Date: 11/29/1995
  • Status: Expired due to Term
First Claim
Patent Images

1. A semiconductor device, comprising:

  • a substrate;

    a semiconductor chip disposed on an upper surface of the substrate;

    a plurality of pads disposed on a lower surface of the substrate;

    said substrate having a first group of through holes connected with signal wirings of the semiconductor chip and formed in an inner part from the periphery of the substrate and a second group of through holes connected to power supply wirings and grounding wirings and formed in a part of the substrate extending from the periphery of a semiconductor chip mounting area;

    wherein a wiring length from the power supply wirings and grounding wirings to the pads via the second group of through holes are shorter than lengths from the signal terminals to the pads via the first group of through holes, and the length of the power supply wirings and the grounding wirings formed on the lower surface of the substrate are shorter than the length of the signal wirings; and

    wherein the power supply wirings and grounding wirings formed on the lower surface of the substrate are formed such that the power supply wirings and the ground wirings do not run through inter-pad areas.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×