Exposure method and apparatus
First Claim
1. An exposure method in which a plurality of reticle patterns are sequentially overlaid with and projected onto a plurality of shot areas formed on a substrate to be processed, said method comprising the steps of:
- measuring positions of a plurality of alignment marks formed within said shot areas;
computing, from thus measured positions of alignment marks and designed position of the alignment marks, an error therebetween;
comparing known distortion data of a plurality of projection lenses and said error with each other so as to specify the projection lens used for forming the alignment marks;
using the distortion data of thus specified projection lens and said error so as to correct a projection image of a reticle pattern; and
performing exposure with thus corrected projection image.
0 Assignments
0 Petitions
Accused Products
Abstract
In the exposure method and apparatus, the distortion data of the projection lens in each exposure unit itself has already been known for each exposure unit. Accordingly, when the exposure unit which formed the alignment target layer has already been known, the known data of this exposure unit is used to correct at least one of the projection magnification and shot rotation determined according to multipoint EGA operation, and the exposure apparatus is adjusted by the amount of this correction. When the exposure unit forming the alignment target layer is unknown, the alignment mark exposure unit is specified from the state of distribution of non-linear error computed from the alignment mark measured values within a shot. Under thus determined correct projection magnification and shot rotation, a shot area is accurately overlaid with and exposed to a reticle pattern.
48 Citations
55 Claims
-
1. An exposure method in which a plurality of reticle patterns are sequentially overlaid with and projected onto a plurality of shot areas formed on a substrate to be processed, said method comprising the steps of:
-
measuring positions of a plurality of alignment marks formed within said shot areas; computing, from thus measured positions of alignment marks and designed position of the alignment marks, an error therebetween; comparing known distortion data of a plurality of projection lenses and said error with each other so as to specify the projection lens used for forming the alignment marks; using the distortion data of thus specified projection lens and said error so as to correct a projection image of a reticle pattern; and performing exposure with thus corrected projection image. - View Dependent Claims (2, 3, 4)
-
-
5. An exposure method in which a reticle pattern is projected to a substrate to be processed, said method comprising the steps of:
-
measuring positions of a plurality of alignment marks formed within said substrate; computing, from thus measured positions of the alignment marks and designed positions of the alignment marks, an error therebetween; and determining, from a predetermined distortion data of a projection lens used for forming said alignment marks and said error, an amount of positional deviation of a projection image of a reticle pattern. - View Dependent Claims (6)
-
-
7. An exposed method in which a predetermined mark is exposed to a substrate by way of a projection optical system, said method comprising the steps of:
-
detecting information regarding a position of alignment marks formed on said substrate; extracting a non-linear component from the detected information; and determining image characteristics of said projection optical system used for forming said alignment mark based on said extracted non-linear component. - View Dependent Claims (8, 9)
-
-
10. A method of detecting a mark in which a mark formed on a substrate by way of a projection optical system is detected, said method comprising the steps of:
-
detecting information regarding a position of said mark; and correcting said information regarding a position of said mark based on characteristics information regarding an image of said projection optical system which formed said mark. - View Dependent Claims (11, 12, 13)
-
-
14. An exposure method in which a plurality of reticle patterns are sequentially overlaid with and projected onto a plurality of shot areas formed on a substrate to be processed, the method comprising the steps of:
-
obtaining information regarding positions of a plurality of marks formed in said plurality of shot areas; obtaining distortion information regarding distortions in previous shot areas based on said position information; and adjusting a pattern image of said reticle based on said position and distortion information. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
-
-
22. An exposure method in which a plurality of reticle patterns are sequentially overlaid with and projected onto a plurality of shot areas formed on a substrate to be processed, the method comprising the steps of:
-
measuring positions of a plurality of alignment marks formed with said plurality of shot areas; computing, from the measured positions and from designed positions of said plurality of alignment marks, an error therebetween; comparing known distortion data of a plurality of projection lenses and said error with each other so as to specify one of said plurality of projection lens to be used for forming the plurality of alignment marks; using the distortion data of the specified projection lens and said error so as to correct a projection image of a reticle pattern; and performing exposure with the corrected projection image. - View Dependent Claims (23, 24, 25, 27)
-
-
26. An exposure method in which a plurality of reticle patterns are sequentially overlaid with and projected, by a plurality of exposure apparatuses, onto a plurality of shot areas formed on a substrate to be processed, the method comprising the steps of:
-
determining distortion data of projection images respectively formed by said plurality of exposure apparatuses; storing the determined distortion data; determining an amount of positional deviation of the projection image of the first reticle pattern formed by the first exposure apparatus at a fixed measurement point on said substrate before exposure of a second layer on said substrate is performed by the second exposure apparatus; correcting, based on the stored distortion data and the amount of positional deviation, the projection image formed by said second exposure apparatus; and performing exposure by said second exposure apparatus with the corrected projection image and, at the correcting step, an amount of correction for the projection image formed by said second exposure apparatus at which overlay accuracy between the respective projection images formed by said first and second exposure apparatuses is optimized is determined from the stored distortion data and, based on amounts of positional deviation in the projection images in said first and second exposure apparatuses at the determined amount of the projection image of said first reticle pattern, the projection image formed by said second exposure apparatus is corrected. - View Dependent Claims (28)
-
-
29. An exposure method for exposing a predetermined pattern onto a substrate by way of a projection system, said method comprising the steps of:
-
measuring a mark formed on the substrate; obtaining first information regarding a position of the mark based on the measuring result; obtaining second information which includes known characteristics regarding a projection image projected onto the substrate when the mark is formed, the second information being obtained based on said first information; and controlling projection of the predetermined pattern onto the substrate based on the first and second information. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
-
-
44. A projection exposure apparatus which exposes a predetermined pattern on to a substrate by way of a projection system, said apparatus comprising:
-
a first obtaining unit, having a observing system that observes said substrate, which measures a mark formed on the substrate by the observing unit and obtains first information regarding to position of the mark; a second obtaining unit, which is electrically connected to a memory, and which obtains second information that corresponds to known characteristics with respect to a projection image projected onto the substrate when the mark is formed, the second information being obtained based on said first information; and a controller, which is electrically connected to said first and second obtaining unit, and which controls projection of the predetermined pattern onto the substrate based on the first and second information. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55)
-
Specification