Apparatus for interconnecting logic boards

• US 6,163,464 A
• Filed: 08/04/1998
• Issued: 12/19/2000
• Est. Priority Date: 08/08/1997
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Watanabe, Tsuyoshi, Yamagiwa, Akira, Ishibashi, Kenichi, Goto, Tsutomu, Hayashi, Takehisa
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US09/128,779
• Time in Patent Office: 868 Days
• Field of Search: 361/788, 361/796, 361/733, 361/803, 361/679, 361/686, 361/777, 361/791, 439/61, 439/62, 439/59, 174/261
• US Class Current: 361/788
• CPC Class Codes: G06F 1/184 Mounting of motherboards
• CPC Class Codes: G06F 1/185 Mounting of expansion boards
• CPC Class Codes: G06F 1/186 Securing of expansion boards in correspondence to slots provided at the computer enclosure
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 7/1445 with double-sided connections

Abstract

Apparatus for interconnecting logic boards is provided with a backplane, a plurality of logic boards connected to the backplane, and a plurality of interconnecting boards, connected to the backplane, for interconnecting the plurality of logic boards. In the apparatus, the plurality of logic boards are connected to the backplane with the logic boards in vertical position at right angles with the interconnecting boards and a specified distance away from the interconnecting boards.

Claims

1. Apparatus for interconnecting logic boards, comprising:

a backplane;

a plurality of logic boards connected to said backplane; and

a plurality of interconnecting boards for interconnecting said plurality of logic boards connected to said backplane,

wherein a plurality of wires connecting said logic boards and said interconnecting boards are made substantially equal in length.

2. Apparatus for interconnecting logic boards according to claim 1, wherein said wires connecting said logic boards and said interconnecting boards are substantially equal in length on said logic boards, said interconnecting boards, and said backplane.

3. Apparatus for interconnecting logic boards according to claim 1, wherein said logic boards are connected to both faces of said backplane.

4. Apparatus for interconnecting logic boards according to claim 1, wherein said interconnecting boards each have a semiconductor integrated circuit device.

5. Apparatus for interconnecting logic boards according to claim 1, wherein said semiconductor integrated circuit device on said interconnecting board forms a switch.

6. Apparatus for interconnecting logic boards according to claim 1, wherein in a semiconductor integrated circuit device on said interconnecting board, after a connector for connecting said interconnecting board and said backplane is divided into regions of the number of said logic boards, I/O pins of said semiconductor integrated circuit device are divided into regions of said number of regions of said connector, and said regions of said connector and said regions of said I/O pins, which are on a one-to-one correspondence, are connected by wires on said interconnecting board.

7. Apparatus for interconnecting logic boards comprising:

a backplane;

a plurality of logic boards connected to said backplane; and

a plurality of interconnecting boards, connected to said backplane, for interconnecting said plurality of logic boards,

wherein said plurality of logic boards are connected to said backplane with said logic boards in a vertical position and a specified distance away from said interconnecting boards.

8. Apparatus for interconnecting logic boards according to claim 7, wherein connectors for connecting said interconnecting boards and said backplane are divided into regions of the number of said logic boards and said regions are allotted to said logic boards in a designated order, wherein connectors for connecting said logic boards and said backplane are divided into regions of the number of said interconnecting boards and said regions are allotted to said interconnecting boards in a designated order, and wherein said regions of the connectors of said interconnecting boards and said regions of the connectors of said logic boards are connected by wires strung on said backplane.

9. Apparatus for interconnecting logic boards according to claim 7, wherein the wires for connecting said logic boards and said interconnecting boards are substantially equal in length on said logic boards, said interconnecting boards and said backplane.

10. Apparatus for interconnecting logic boards according to claim 7, wherein said logic boards are connected on both faces of said backplane.

11. Apparatus for interconnecting logic boards according to claim 7, wherein said interconnecting boards each include a semiconductor integrated circuit device.

12. Apparatus for interconnecting logic boards according to claim 7, wherein said semiconductor integrated circuit device provided on said interconnecting board forms a switch.

13. Apparatus for interconnecting logic boards according to claim 7, wherein in a semiconductor integrated circuit device on said interconnecting board, after a connector for connecting said interconnecting board and said backplane is divided into regions of the number of said logic boards, I/O pins of said semiconductor integrated circuit device are divided into regions of said number of regions of said connector, and said regions of said connector and said regions of said I/O pins, which are on a one-to-one correspondence, are connected by wires on said interconnecting board.