Radio frequency identification transponder having non-encapsulated IC chip

• US 6,164,551 A
• Filed: 10/29/1998
• Issued: 12/26/2000
• Est. Priority Date: 10/29/1997
• Status: Expired due to Term

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: Meto International GmbH (CCL Industries Incorporated)
• Inventors: Altwasser, Richard
• Primary Examiner(s): LEE, MICHAEL GUNYOUNG
• Application Number:
  US09/181,555
• Time in Patent Office: 789 Days
• Field of Search: 235/492, 235/472.02, 235/488, 235/383, 235/385, 343/872, 343/895
• US Class Current: 235/492
• CPC Class Codes: G01V 15/00 Tags attached to, or associated with, an object, in order to enable detection of the object record carriers for use with machines having a detectable tag or marker G06K19/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2431 Tag circuit details
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags

Abstract

The present invention is directed to an identification element having an integrated circuit and an antenna coil ( RFID transponder) connected to the integrated circuit, as well as to a method of manufacturing such an identification element. The present invention provides an economically priced identification element and a method of manufacturing such an identification element. The integration circuit is a non-encapsulated chip and the antenna coil comprises at least one layer of a metallic coating.

Claims

1. An identification element having:

an integrated circuit comprising a non-encapsulated chip; and

an antenna coil (RFID transponder) connected to said integrated circuit, said antenna coil comprising at least one layer of a metallic coating.

2. The identification element as defined in claim 1, wherein said antenna coil forms a resonant circuit.

3. The identification element as defined in claim 2, wherein said resonant circuit possesses a O factor and wherein said Q-factor is at least higher than 50.

4. The identification element as defined in claim 2, wherein said resonant circuit has a capacitance associated therewith, and wherein said capacitance exceeds InF.

5. The identification element as defined in claim 2, wherein said resonant circuit includes a resonant frequency security element having a resonant frequency different from that of said identification element, and wherein said resonant frequency security element is turned to an interrogating field of an electronic article monitoring device, and emits a characteristic signal as soon as it is incited to resonate by the electronic article monitoring device.

6. The identification element as defined in claim 5, wherein at least one of said identification element and said resonant frequency security element are arranged on a substrate.

7. The identification element as defined in claim 1, wherein said antenna coil is connected to said non-encapsulated chip by a contacting method selected from one of a conductive adhesive;

soldering; and

the flipchip method, all of which are employed in the production of semiconductors.

9. The identification element as defined in claim 1, further having:

a capacitor which stores an amount of energy sufficient to activate said non-encapsulated chip as and when required.

8. The identification element as defined in clam 1, wherein said identification element has a capacitance associated therewith, said capacitance comprises the capacitance of said antenna coil, the capacitance of said integrated circuit, and wherein the capacitance of said antenna coil is greater than that of said integrated circuit.

10. A method of manufacturing an identification element having an integrated circuit and an antenna coil (RFID transponder), comprising the steps of:

forming the antenna coil as at least one layer of a metallic coating;

forming the integrated circuit as a non-encapsulated chip; and

connecting said antenna coil to the non-encapsulated chip.

11. The method as defined in claim 10, further comprising the step of:

connecting the antenna coil to the non-encapsulated chip by a method selected from one of;

a conductive adhesive;

soldering; and

the flipchip method, all of which are employed in the production of semiconductors.