Process solution supplying apparatus

• US 6,165,270 A
• Filed: 06/26/1998
• Issued: 12/26/2000
• Est. Priority Date: 07/04/1997
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Konishi, Nobuo, Hirose, Keizo
• Primary Examiner(s): SELLS, JAMES D
• Application Number:
  US09/105,166
• Time in Patent Office: 914 Days
• Field of Search: 118/300, 118/313, 118/314, 118/315, 118/320, 118/663, 118/688, 118/692
• US Class Current: 118/692
• CPC Class Codes: B05C 11/08 Spreading liquid or other fluent material by manipulating the work, e.g. tilting
• CPC Class Codes: B05C 11/1002 Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
• CPC Class Codes: B05C 11/101 responsive to weight of a container for liquid or other fluent material; responsive to level of liquid or other fluent material in a container
• CPC Class Codes: B05C 11/1042 provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence

Abstract

A process solution supplying mechanism for supplying a process solution to a wafer, comprises a source for containing the process solution, a pipe for introducing the process solution from the source to the wafer, a process solution supply driving system for supplying the process solution from the source to the wafer, and a process solution supplying/stopping mechanism for carrying out apply and stop of the process solution, wherein the pipe and the process solution supply driving system are provided separately and the process solution supplying/stopping mechanism is provided to a portion other than the pipe.

Claims

1. A process solution supplying apparatus for supplying a process solution to a substrate to be processed by a photolithographic process, comprising:

a source configured to contain the process solution;

a nozzle configured to supply the process solution to the substrate;

a pipe provided between the source and the nozzle and having a passage configured to introduce the process solution from the source directly to the nozzle;

a driving system configured to apply a drive force to the process solution so as to supply the process solution from the source to the nozzle via the pipe; and

a supplying/stopping mechanism configured to allow/prevent transmission of the drive force from the driving system to the process solution in the source so as to supply/stop the process solution from the source to the nozzle,

wherein the pipe and the driving system are provided separately, and

wherein the source is provided between the supplying/stopping mechanism and the pipe, and

wherein the passage of the pipe is smooth and substantially continuous.

2. The apparatus according to claim 1, wherein the supplying/driving system has a gas pressure applying mechanism configured to apply a gas pressure to the solution contained in the process source to send out the process solution.

3. The apparatus according to claim 2, wherein the supplying/driving system has a gas pressure controlling mechanism configured to control a pressure of the gas pressure applying mechanism.

4. The apparatus according to claim 1, wherein the supplying/stopping mechanism is provided in the driving system.

5. The apparatus according to claim 1, wherein the supplying/stopping mechanism has a valve configured to allow/prevent transmission of the drive force to the process solution contained in the source.

6. A process solution supplying apparatus for supplying a process solution to a substrate to be processed, comprising:

a process solution source configured to contain the process solution;

a nozzle configured to supply the process solution to the substrate;

a first pipe provided between the process solution source and the nozzle and configured to introduce the process solution from the process solution source directly to the nozzle;

a pressure applying gas source configured to supply a gas to apply a pressure to the process solution contained in the process solution source;

a second pipe configured to introduce the gas in the pressure applying gas source to the process solution source; and

a gas pressure applying/stopping valve provided in the second pipe, and configured to apply/stop the gas pressure,

wherein the first pipe and the second pipe are provided separately,

wherein the process solution can be supplied to the substrate to be processed via the nozzle and the first pipe by applying the pressure to the process solution contained in the process solution source from the pressure applying gas source via the second pipe in a situation that the gas pressure applying/stopping valve is opened,

wherein supply of the process solution can be stopped by closing the gas pressure applying/stopping valve, and

wherein the process solution is provided between the valve and the first pipe and the first pipe has a passage configured to introduce the process solution to the substrate, the passage being smooth and substantially continuous.

7. The apparatus according to claim 6, further comprising:

a third pipe whose one end is inserted into the process solution source and other end is communicated with ambient atmosphere; and

an outer air opening valve provided to the third pipe.

8. The apparatus according to claim 7, further comprising a controlling mechanism configured to control the gas pressure applying/stopping valve and the outer air opening valve.

9. The apparatus according to claim 8, further comprising a sensor configured to detect a level of the process solution at a tip portion of the first pipe, and

wherein the controlling mechanism controls the outer air opening valve based on a detection signal from the sensor.

10. The apparatus according to claim 7, further comprising:

a pressure applying mechanism configured to apply a minute pressure only slightly to the process solution source in a situation that the gas pressure applying/stopping valve and the outer air opening valve are closed; and

a regulator configured to regulate the minute pressure.

11. The apparatus according to claim 6, further comprising a regulator provided to the second pipe, and configured to regulate the pressure in the pressure applying gas source.

12. A liquid discharging device, comprising:

a liquid source configured to contain a liquid which is applied to an object to be processed;

a liquid discharging pipe communicating with the liquid source, and having a nozzle configured to discharge the liquid and a passage configured to introduce the process solution from the source directly to the nozzle;

a liquid discharge driving system configured to provide a driving force to the liquid so as to discharge the liquid from the nozzle; and

a liquid discharging/stopping mechanism configured to discharge/stop the liquid,

wherein the liquid discharging pipe and the liquid discharge driving system are provided separately,

wherein the source is provided between the liquid discharging/stopping mechanism and the liquid discharging pipe, and

wherein the passage of the pipe is smooth and simple and is substantially continuous.

13. The device according to claim 12, wherein the liquid discharge driving system has a gas pressure applying mechanism configured to apply a gas pressure to the liquid contained in the liquid source to send out the liquid by the gas pressure.

14. The device according to claim 13, wherein the liquid discharge driving system has a gas pressure controlling mechanism configured to control a pressure of the gas pressure applying mechanism.

15. The device according to claim 12, wherein the liquid discharging/stopping mechanism is provided in the liquid discharge driving system.

16. The device according to claim 12, wherein the liquid discharging/stopping mechanism has a valve.