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Scan tool recipe server

  • US 6,165,805 A
  • Filed: 10/29/1998
  • Issued: 12/26/2000
  • Est. Priority Date: 10/29/1998
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a semiconductor wafer, the method comprising:

  • processing a first layer on a semiconductor wafer;

    determining that a recipe in a scan tool in which the semiconductor wafer is to be scanned is the current recipe,wherein the step of determining that the recipe in the scan tool in which the semiconductor wafer is to be scanned is the current recipe is accomplished by comparing the recipe in the scan tool with a recipe in a server; and

    scanning the first layer of the semiconductor wafer using the current recipe.

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