Method of making components with solder balls

• US 6,165,885 A
• Filed: 07/14/1998
• Issued: 12/26/2000
• Est. Priority Date: 08/02/1995
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Gaynes, Michael Anthony, Pierson, Mark Vincent
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): HOANG, QUOC DINH
• Application Number:
  US09/115,130
• Time in Patent Office: 896 Days
• Field of Search: 438/612, 438/613, 438/614, 438/615, 438/616, 257/737, 257/738
• US Class Current: 438/612
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: H01L 21/4867 Applying pastes or inks, e.g. screen printing H01L21/486 takes precedence
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05027 the internal layer extending out of an opening
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/11003 for holding or transferring the bump preform
• CPC Class Codes: H01L 2224/1132 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/11334 using preformed bumps
• CPC Class Codes: H01L 2224/1182 Applying permanent coating, e.g. in-situ coating
• CPC Class Codes: H01L 2224/1184 involving a mechanical process, e.g. planarising the bump connector
• CPC Class Codes: H01L 2224/13006 Bump connector larger than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13011 comprising apertures or cavities, e.g. hollow bump
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16237 : the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/29099 : Material
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 : the item being metallic
• CPC Class Codes: H01L 2224/45124 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/742 : Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 2224/81136 : involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 23/49805 : the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01L 2924/3841 : Solder bridging
• CPC Class Codes: H05K 2201/035 : Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10992 : Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 2203/0113 : Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 2203/0338 : Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component affixing a prefabricated conductor pattern H05K3/20
• CPC Class Codes: H05K 2203/043 : Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/0557 : Non-printed masks
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3463 : Solder compositions in relation to features of the printed circuit board or the mounting process
• CPC Class Codes: H05K 3/3485 : Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12

Abstract

An electronic component with solder ball connections is provided. A stencil is produced with holes passing through it in an arrangement corresponding to an arrangement of conductive pads on a substrate or integrated circuit. The stencil is made of a solder reflow compatible material. A layer of adhesive is applied to the stencil which is then positioned with the layer of adhesive adjacent the substrate or integrated circuit with the holes aligned with the conductive pads. Solder paste is deposited in the holes and is heated along with the conductive pads to form solder balls on the conductive pads.

Claims

1. A method of making an electronic component, comprising the steps of:

providing an electronic substrate including a wiring layer having an arrangement of electrically conductive pads;

producing a stencil of a solder reflow compatible material with holes passing through said stencil, said holes located in a mirror image arrangement corresponding to said arrangement of said electrically conductive pads;

applying a layer of a solder reflow compatible adhesive to said stencil;

positioning said stencil such that said layer of adhesive is adjacent said electronic substrate and said holes are aligned with said conductive pads;

thereafter depositing solder in paste form into and substantially filling said holes, and into contact with said electrically conductive pads; and

heating said solder and said electrically conductive pads to form balls of solder on said pads.

2. The method of claim 1 wherein said stencil is produced from a polyimide material.

3. The method of claim 1 wherein said stencil is produced from a silicone rubber.

4. The method of claim 1 wherein said adhesive is applied as a layer of pressure sensitive silicone adhesive.

5. The method of claim 1 wherein said solder in paste form is deposited by spreading with a squeegee.

6. The method of claim 1 further comprising the step of separating said stencil from said electronic substrate.

7. A method of producing a semiconductor chip, comprising the steps of:

forming a semiconductor integrated circuit having a wiring layer with an arrangement of electrically conductive pads;

producing a stencil of a solder reflow compatible material with holes passing through said stencil, said holes located in a mirror image arrangement corresponding to said arrangement of said electrically conductive pads;

applying a layer of a solder reflow compatible adhesive to said stencil;

positioning said stencil such that said layer of adhesive is adjacent said integrated circuit and said holes are aligned with said conductive pads;

thereafter depositing solder in paste form into and substantially filling said holes, and into contact with said electrically conductive pads; and

heating said solder and said electrically conductive pads to form balls of solder on said pads.